Amir Afshani, Wenqiang Xiang, Tarek Djerafi, Mohamed Chaker
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引用次数: 0

摘要

毫米波交换机对于可重构和自适应通信系统至关重要,但目前的解决方案往往面临性能、可扩展性和成本之间的权衡。在这里,我们提出了一种可扩展,高性能和经济高效的方法,通过将二氧化钒(VO₂)薄膜与印刷电路板(PCB)技术集成来开发可重构的毫米波衬底集成波导(SIW)器件。集成技术包括将VO 2薄膜沉积在薄的柔性聚合物基板上,然后将其转移并粘贴到PCB电路上。VO₂是热激活和选择性掺杂,以减少功耗取决于应用。通过实验原型,我们展示了在毫米波频段工作的几种可重构器件,包括串联和并联开关以及可转换为双直通线siw的可重构混合耦合器。电磁仿真和测量验证了该方法,揭示了低插入损耗,良好的隔离和宽带运行。这种方法简化了制造,支持大面积集成,为可扩展、低成本、可重构的毫米波组件提供了一条实用的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Vanadium dioxide thin films integrated with printed circuit board enables low-cost, reconfigurable millimeter-wave devices.

Millimeter-wave switches are essential for reconfigurable and adaptive communication systems, yet current solutions often face trade-offs between performance, scalability, and cost. Here we present a scalable, high performance and cost-effective approach to develop reconfigurable millimeter-wave substrate integrated waveguide (SIW) devices by integrating vanadium dioxide (VO₂) thin films with printed circuit board (PCB) technologies. The integration technique involves depositing VO₂ films on thin, flexible polymer substrates, which are then transferred and affixed to PCB circuits. The VO₂ is thermally activated and selectively doped to reduce power consumption depending on applications. Using experimental prototypes, we demonstrate several reconfigurable devices operating in the millimeter-wave band, including series and parallel switches and a reconfigurable hybrid coupler that transforms into dual through-line SIWs. Electromagnetic simulations and measurements validate the approach, revealing low insertion loss, good isolation, and broadband operation. This method simplifies fabrication and supports large-area integration, offering a practical route to scalable, low-cost, reconfigurable millimeter-wave components.

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