Numerical Investigation to Analyze the Effect of Various Operating Parameters on the Thermal Characteristics of Heat Pipe

The heat pipe is one of the prime candidates in electronic thermal management due to its higher thermal performance and passive nature. The present study aims to develop a 3D mathematical model to simulate the thermal behavior of the heat pipe of length 380 mm under different operating conditions. Steady-state numerical simulations are performed to predict the effect of heat inputs (in the range of 10–50 W), the coolant flow rates (40 LPH, 25 LPH, and 10 LPH), and the coolant inlet temperatures (298.15, 293.15, and 288.15 K) on the heat pipe's thermal characteristics. The analysis reveals that by increasing the heat input from 10 to 50 W, the heat pipe's thermal resistance is reduced by 49.23%, with the same amount of augmentation in its evaporator heat transfer coefficient. The cooling water flow rate also significantly impacted the heat pipe's thermal resistance and heat transfer coefficient. The evaporator heat transfer coefficient decreased by 2.01% at 25 LPH compared to 10 LPH and increased by 1.68% at 40 LPH compared to 25 LPH. Additionally, with the increase in the cooling water inlet temperature from 288.15 K to 293.15 K, the heat pipe's evaporator heat transfer coefficient increased by 7.55%, and thermal resistance was reduced by 6.02%. This confirms the vivid influence of the input thermal energy and cooling water inlet temperature on the heat pipe's thermal characteristics, while the cooling water Reynolds number (flow rate) had a minimal influence on its operating conditions. Hence, this comprehensive analysis of using the heat pipe offers valuable insight for improving heat dissipation and thermal management in electronic devices.