e平面微带天线阵列的超低轮廓去耦贴片结构

IF 4.8 2区计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Antennas and Wireless Propagation Letters Pub Date : 2025-09-02 DOI:10.1109/LAWP.2025.3605586

Bingyi Qian;Aofang Zhang;Xiaoming Chen;Ahmed A. Kishk

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引用次数: 0

摘要

提出了一种用于e平面微带天线阵列的超低轮廓去耦贴片（DP）结构。不需要修改接地或复杂的电路，DP引入了二次耦合路径，破坏性地干扰表面波耦合。1 × 4阵列的全波模拟和实验结果验证了该设计，显示出从- 17 dB到- 55 dB的隔离增强，同时保持稳定的增益，高效率和不变的辐射方向图。

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Ultralow-Profile Decoupling Patch Structure for E-Plane Microstrip Antenna Arrays

An ultralow-profile decoupling patch (DP) structure is proposed for E-plane microstrip antenna arrays. Without requiring ground modification or complex circuitry, the DP introduces a secondary coupling path that destructively interferes with surface wave coupling. Full-wave simulations and experimental results of a 1 × 4 array validate the design, showing isolation enhancement from −17 dB to −55 dB while preserving stable gain, high efficiency, and unaltered radiation patterns.

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来源期刊

IEEE Antennas and Wireless Propagation Letters 工程技术-电信学

CiteScore

8.00

自引率

9.50%

发文量

529

审稿时长

1.0 months

期刊介绍： IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.