{"title":"预测氢键介导的纳米粒子相互作用的表面键合模型","authors":"Lingzhi Li, and , Zhaochuan Fan*, ","doi":"10.1021/acs.jpclett.5c02757","DOIUrl":null,"url":null,"abstract":"<p >Surface ligands leveraging dynamic hydrogen bonding offer promising strategies for nanoparticle assembly, yet mechanistic understanding remains limited. Here, we investigate hydrogen bond dynamics between diaminopyridine (DAP) and thymine (Thy) ligands on Au nanoparticles using molecular dynamics simulations. Results reveal a kinetic lag of hundreds of nanoseconds for hydrogen bond equilibration, with hydrogen bond formation probability and average bonding energies linearly inversely proportional to supramolecular outer surface density. These linear correlations enable the development of a parameter-resolved Surface Bonding Model (SBM) that quantitatively predicts interparticle interaction strengths in solution. SBM facilitates rapid evaluation of interaction landscapes across multivariate parameter spaces and provides key insights into the precise control of nanocomposite assembly.</p>","PeriodicalId":62,"journal":{"name":"The Journal of Physical Chemistry Letters","volume":"16 41","pages":"10669–10677"},"PeriodicalIF":4.6000,"publicationDate":"2025-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Surface Bonding Model for Predicting Hydrogen Bond-Mediated Nanoparticle Interactions\",\"authors\":\"Lingzhi Li, and , Zhaochuan Fan*, \",\"doi\":\"10.1021/acs.jpclett.5c02757\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >Surface ligands leveraging dynamic hydrogen bonding offer promising strategies for nanoparticle assembly, yet mechanistic understanding remains limited. Here, we investigate hydrogen bond dynamics between diaminopyridine (DAP) and thymine (Thy) ligands on Au nanoparticles using molecular dynamics simulations. Results reveal a kinetic lag of hundreds of nanoseconds for hydrogen bond equilibration, with hydrogen bond formation probability and average bonding energies linearly inversely proportional to supramolecular outer surface density. These linear correlations enable the development of a parameter-resolved Surface Bonding Model (SBM) that quantitatively predicts interparticle interaction strengths in solution. SBM facilitates rapid evaluation of interaction landscapes across multivariate parameter spaces and provides key insights into the precise control of nanocomposite assembly.</p>\",\"PeriodicalId\":62,\"journal\":{\"name\":\"The Journal of Physical Chemistry Letters\",\"volume\":\"16 41\",\"pages\":\"10669–10677\"},\"PeriodicalIF\":4.6000,\"publicationDate\":\"2025-10-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Journal of Physical Chemistry Letters\",\"FirstCategoryId\":\"1\",\"ListUrlMain\":\"https://pubs.acs.org/doi/10.1021/acs.jpclett.5c02757\",\"RegionNum\":2,\"RegionCategory\":\"化学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Journal of Physical Chemistry Letters","FirstCategoryId":"1","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acs.jpclett.5c02757","RegionNum":2,"RegionCategory":"化学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
A Surface Bonding Model for Predicting Hydrogen Bond-Mediated Nanoparticle Interactions
Surface ligands leveraging dynamic hydrogen bonding offer promising strategies for nanoparticle assembly, yet mechanistic understanding remains limited. Here, we investigate hydrogen bond dynamics between diaminopyridine (DAP) and thymine (Thy) ligands on Au nanoparticles using molecular dynamics simulations. Results reveal a kinetic lag of hundreds of nanoseconds for hydrogen bond equilibration, with hydrogen bond formation probability and average bonding energies linearly inversely proportional to supramolecular outer surface density. These linear correlations enable the development of a parameter-resolved Surface Bonding Model (SBM) that quantitatively predicts interparticle interaction strengths in solution. SBM facilitates rapid evaluation of interaction landscapes across multivariate parameter spaces and provides key insights into the precise control of nanocomposite assembly.
期刊介绍:
The Journal of Physical Chemistry (JPC) Letters is devoted to reporting new and original experimental and theoretical basic research of interest to physical chemists, biophysical chemists, chemical physicists, physicists, material scientists, and engineers. An important criterion for acceptance is that the paper reports a significant scientific advance and/or physical insight such that rapid publication is essential. Two issues of JPC Letters are published each month.