完全兼容CMOS电荷阱存储器的储层计算系统

IF 6.4 3区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Suyong Park, Donghyun Ryu, Sungjoon Kim, Woo Young Choi, Sungjun Kim
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引用次数: 0

摘要

储层计算(RC)系统因其在时间数据处理方面的有效性而受到广泛关注。虽然对RC系统进行了广泛的研究,但对互补金属氧化物半导体兼容闪存器件的研究仍然很少。在本研究中,探索了基于TiN/Al2O3/Si3N4/SiO2/poly-Si (TANOS)的RC系统的潜力,利用高压退火(HPA)工艺来提高器件的性能。具体来说,经hpa处理的TANOS器件用于读出层,以确保稳定的长期记忆特性,而未经处理的TANOS器件用于储层,利用其由界面陷阱诱导的短期记忆特性。本研究还探讨了TANOS设备用于神经形态计算的可行性。基于改进的美国国家标准与技术研究所的仿真,基于tanos的完整RC系统的识别率达到84.48%,显示了其在时间模式识别任务中的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Fully CMOS Compatible Charge Trap Memory-Based Reservoir Computing System

Fully CMOS Compatible Charge Trap Memory-Based Reservoir Computing System

Reservoir computing (RC) systems have gained considerable attention for their effectiveness in temporal data processing. Although extensive research has been conducted on RC systems, studies focusing on complementary metal-oxide semiconductor-compatible flash memory devices remain scarce. In this study, the potential of RC systems based on TiN/Al2O3/Si3N4/SiO2/poly-Si (TANOS) is explored, utilizing the high-pressure annealing (HPA) process to enhance the performance of the device. Specifically, HPA-treated TANOS devices are employed in the readout layer to ensure stable long-term memory characteristics, while untreated TANOS devices are used in the reservoir layer, leveraging their short-term memory properties induced by interfacial traps. This study also investigates the feasibility of TANOS devices for neuromorphic computing. Based on Modified National Institute of Standards and Technology simulations, the complete TANOS-based RC system achieves a recognition rate of 84.48%, demonstrating its potential for temporal pattern recognition tasks.

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来源期刊
Advanced Materials Technologies
Advanced Materials Technologies Materials Science-General Materials Science
CiteScore
10.20
自引率
4.40%
发文量
566
期刊介绍: Advanced Materials Technologies Advanced Materials Technologies is the new home for all technology-related materials applications research, with particular focus on advanced device design, fabrication and integration, as well as new technologies based on novel materials. It bridges the gap between fundamental laboratory research and industry.
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