W/Mg共掺杂VO2薄膜的转变温度、光学性能和结构性能得到改善

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
H. F. Haji, M. E. Samiji, N. R. Mlyuka
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引用次数: 0

摘要

在425℃的衬底温度下,用镁、钨、钒(V(99%)W(1%)合金靶材共溅射法制备了W/Mg共掺杂VO2薄膜。采用x射线衍射、原子力显微镜、卢瑟福后向散射光谱、两点探针和紫外/可见/近红外光谱仪对薄膜进行了表征。W/Mg共掺杂VO2膜,浓度为~0.95 at。%和~3.1 at。W和Mg的晶粒尺寸相对较小,迟滞环宽度为3.9 nm和~2°C,而原始VO2的迟滞环宽度分别为11.4 nm和17.8°C。共掺杂样品的综合透光率为~47%,而w掺杂和原始VO2薄膜的综合透光率分别为26%和41%。与未掺杂和w掺杂的vo2基薄膜的转变温度分别为64.8°C和44°C相比,共掺杂薄膜的转变温度显著降低至33°C以下。这项工作表明,在w掺杂的VO2薄膜中控制一定量的Mg可以潜在地使VO2薄膜用于智能窗口应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
W/Mg co-doped VO2 thin films with improved transition temperature, optical, and structural properties

W/Mg co-doped VO2 thin films were prepared by co-sputtering of magnesium, tungsten, and vanadium (V(99%)W(1%) alloy targets at a substrate temperature of 425 °C. The films were characterized by X-ray diffraction, atomic force microscopy, Rutherford backscattering spectroscopy, the two-point probe, and UV/VIS/NIR Spectrometer. W/Mg co-doped VO2 films with concentrations of~0.95 at.% and~3.1 at.% for W and Mg, respectively, showed relatively lower crystallite sizes and reduced hysteresis loop widths of 3.9 nm and~2 °C compared to 11.4 nm and 17.8 °C, respectively, for pristine VO2. The integrated luminous transmittance of the co-doped samples was~47%, compared to 26% and 41% for the W-doped and pristine VO2 films, respectively. A significant reduction in transition temperature to below 33 °C was realized for the co-doped films, compared to 64.8 °C and 44 °C for the undoped and W-doped VO2-based thin films, respectively. This work shows that a controlled amount of Mg in the W-doped VO2 films could potentially make VO2 thin films useful for smart window applications.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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