低压一维压电MEMS扫描微镜的设计

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Yuanjie Wang;Xiaowei Zhang;Yang Tang;Honghao Wang;Fanjun Zhai;Chenxi Gao;Jianpeng Xing;Chaobo Li;Jing Xie;Dapeng Sun
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引用次数: 0

摘要

为了应对低压器件在推进小型化技术中的迫切需求,本研究介绍了一种采用c梁悬臂结构的开创性压电微机电系统(MEMS)扫描微镜架构。本研究采用具有优异横向压电系数(d31)和介电常数的锆钛酸铅(PZT)薄膜,创新地设计和制造了三种保持等效驱动面积的微镜器件(参考设计、t梁设计和c梁设计)。研究表明,c梁结构在驱动电压效率方面表现出优异的性能。与t形光束设计相比,在相同扫描角条件下(30°),驱动电压从70 Vpp降低到6 Vpp,降低了91.42%。在−30 V, 25 min的预极化过程中,c束微镜在24 Vpp的驱动电压下实现了87.56°的光学扫描角。这一重大改进突出了结构几何和预极化处理在MEMS致动器性能中的关键作用。(2025 - 0061)
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On the Design of Low Voltage One-Dimensional Piezoelectric MEMS Scanning Micromirror
In response to the critical need for low-voltage devices in advancing miniaturization technology, this study introduces a groundbreaking piezoelectric micro-electro-mechanical-systems (MEMS) scanning micromirror architecture employing a C-beam cantilever structure. This study employs lead zirconate titanate (PZT) thin films with excellent transverse piezoelectric coefficient (d31) and dielectric constant and innovatively designs and fabricates three micromirror devices (reference design, T-beam design, and C-beam design) that maintain equivalent driving areas. This study demonstrates that the C-beam structure exhibits outstanding performance in driving voltage efficiency. Compared to the T-shaped beam design, under identical scanning angle conditions (30°), the driving voltage is reduced from 70 Vpp to 6 Vpp — a 91.42% reduction. Furthermore, after implementing a pre-polarization process (−30 V, 25 min), the C-beam micromirror achieves the optical scanning angle of 87.56° at 24 Vpp driving voltage. This significant improvement highlights the critical role of structural geometry and pre-polarization treatment in MEMS actuator performance. [2025-0061]
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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