用梯度热法测量不同形状表面饱和水沸腾过程中的热流密度

IF 1 Q4 ENERGY & FUELS
P. G. Bobylev, A. V. Pavlov, V. Yu. Mityakov, A. A. Gusakov, S. Z. Sapozhnikov
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引用次数: 0

摘要

许多行业技术的发展对电源模块的热性能控制提出了严格的要求。例如,第四代现代双极功率晶体管的最高工作温度超过175°С,热流密度(HF)超过1 MW/m2。去除这种热流需要基于沸腾的冷却系统。只有直接测量电源模块的热流密度,才能控制电源模块的散热。本文采用非均匀梯度热流传感器(HGHFS)直接测量局部热流。这些传感器是研究相变过程的可靠工具。由于表面翅片大大增加了传热表面积,因此对带有一个、三个和五个纵翅片的翅片模型进行了研究。通过实验确定了饱和水在水平面上沸腾时的第一临界热流密度。将HGHFS信号与热电偶信号进行了比较。已经确定,不能用温度测量来确定沸腾危机的开始,因为在温度开始上升时热流密度已经超过了第一个临界热流密度。热电偶信号相对于HGHFS信号的延迟为0.5 s。对翅片表面沸腾过程的局部热流密度与平面沸腾过程的热流密度进行了比较。所有研究表面的传热都得到了增强。模拟电源模块的温度相对于水平板的温度可降低11.7-20.5%。当翅片比为7.4时,温度下降了20.5%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Measurement of Heat Flux during Saturated Water Boiling on Surfaces of Different Shapes Using the Gradient Heatmetry Method

Measurement of Heat Flux during Saturated Water Boiling on Surfaces of Different Shapes Using the Gradient Heatmetry Method

The development of technologies in many industries has imposed strict requirements on the control of thermal performance control of power modules. For example, the maximum operating temperature of modern bipolar power transistors of fourth generation exceeds 175°С at a heat flux (HF) above 1 MW/m2. Removal of such heat fluxes requires boiling-based cooling systems. The heat release of a power module cannot be controlled without direct measurement of its heat flux. In this work, heterogeneous gradient heat-flux sensors (HGHFS) are employed, which can directly measure local heat fluxes. These sensors are a reliable tool for investigating phase transition processes. Since surface finning considerably increases the heat-transfer surface area, finned models with one, three, and five longitudinal fins are examined. The first critical heat flux during saturated water boiling on a horizontal surface was determined experimentally. The HGHFS signal was compared with a thermocouple signal. It has been established that the onset of a boiling crisis cannot be determined using temperature measurements since the heat flux already exceeds the first critical heat flux by the time the temperature begins to rise. The delay of the thermocouple signal relative to the HGHFS signal is 0.5 s. The local heat flux during boiling on finned surfaces is compared with the heat flux during boiling on a flat surface. Heat-transfer enhancement was obtained for all studied surfaces. The temperature of the simulated power module could be reduced by 11.7–20.5% relative to the temperature of a horizontal plate. With a finning ratio of 7.4, the temperature drop decreased by 20.5%.

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来源期刊
CiteScore
1.30
自引率
20.00%
发文量
94
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