Research on Grinding Removal Mechanism of SiCf/SiC Composite Materials Based on Random Multi-Abrasive Particles

SiC_f/SiC composites are widely used in aerospace and automotive electronics because of their low density, high strength, anti-fatigue, and easy weaving. As an important precision machining method, grinding processing has significant advantages, especially in the processing of high hardness materials, high precision requirements and high surface quality parts manufacturing plays a vital role. In this paper, to address the problem of difficult machining of SiC_f/SiC composites by grinding, we take SiC_f/SiC composites as the research object and analyze the process of fiber breakage removal by grinding as the machining method. The generation of randomized abrasive grain model is carried out by Python script programming. Based on the 3D-Hashin failure criterion, a 3D multi-grain grinding simulation model was established to explore the influence of the grinding process on the microstructure evolution law during the material removal process, and to further investigate the grinding removal mechanism of SiC_f/SiC composites. The results show that the grinding parameters have a significant effect on the surface quality, and higher wheel speed can improve the surface quality, while the increase of feed rate and grinding depth may lead to the elevation of surface roughness, especially the larger grinding depth will significantly aggravate the surface damage and crack extension. The combination of finite element simulation and experiment can effectively reveal the stress and strain distribution and the law of material damage in the grinding process, thus providing theoretical basis for optimizing the grinding process and improving the material processing performance.