微电子电阻元件用高熵CoCrFeNiTix合金薄膜

IF 0.7 Q3 Engineering

Surface Engineering and Applied Electrochemistry Pub Date : 2025-07-11 DOI:10.3103/S1068375525700322

M. V. Polyakov, A. S. Rogachev, D. Yu. Kovalev, S. G. Vadchenko, D. O. Moskovskikh, F. V. Kiryukhantsev-Korneev, L. S. Volkova, A. P. Orlov

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引用次数: 0

摘要

采用磁控溅射的方法，将粉末混合物热压制成多组分靶材，首次在硅衬底上获得高熵CoCrFeNiTix合金薄膜。研究了这些薄膜的微观结构和相组成。制作了电阻薄膜元件，并在不同温度下测量其电阻。结果表明，新型电阻元件的电阻值与温度呈线性关系，负温度系数TCR = -4.66 × 10-5 K-1。

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Thin High Entropy CoCrFeNiTix Alloy Films for Resistive Elements of Microelectronics

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Thin High Entropy CoCrFeNiTix Alloy Films for Resistive Elements of Microelectronics

Using the method of magnetron sputtering from a multicomponent target manufactured by hot pressing of a powder mixture, thin films of a high-entropy CoCrFeNiTi_x alloy on silicon substrates were first obtained. The microstructure and phase composition of these films have been studied. Resistive thin-film elements are made and their electrical resistance is measured at different temperatures. It is shown that the value of the electrical resistance of new resistive elements linearly depends on temperature with the negative temperature coefficient TCR = –4.66 × 10^–5 K^–1.

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来源期刊

Surface Engineering and Applied Electrochemistry Engineering-Industrial and Manufacturing Engineering

CiteScore

1.60

自引率

22.20%

发文量

期刊介绍： Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.