Recent progress and challenges of photosensitive polyimides in advanced packaging: Technology beyond limit

With the advancements in technology, the continuation of Moore’s law has become increasingly challenging. Consequently, heterogeneous integration (HI) and advanced packaging have emerged as critical focal points within the microelectronics industry. However, to mitigate the power dissipation and noise in interconnects, these advanced packaging systems require materials with low dielectric constants. Photosensitive polyimide (PSPI) is one such high-performance material emerging as a suitable candidate for advanced packaging applications due to its exceptional thermal, mechanical, and electrical insulation properties. In this review, we provide a detailed analysis of PSPIs particularly chemistry, formulations, working mechanism and properties essential for advanced packaging. Some recent advancements in PSPIs are reviewed along with a discussion of their key applications in advanced packaging. Finally, current challenges of PSPIs are briefly addressed with possible solutions and future prospects. This review article is potentially beneficial for future research and development in advanced packaging and HI processing.