异质三维集成电路的浸没沸腾热管理优化

IF 5.8 2区 工程技术 Q1 ENGINEERING, MECHANICAL
Bingcheng Li, Xingbao An, Zekai Liu, Min Zeng, Qiuwang Wang
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引用次数: 0

摘要

为了解决3D集成电路(3dic)中高热流密度的热管理挑战,本研究引入了一种以HFE-7100为工作流体的浸入式沸腾冷却策略。建立了基于临界气泡半径和气泡生长因子的相变机理的热流体耦合数值模型,模拟了气泡的成核、生长和离开过程。表面张力和接触角效应也包括在内,以提高微观尺度物理保真度。引入了一种基于电阻网络的结构简化方法,在保持热精度的同时降低了网格复杂性,使计算效率提高了81.4%。通过等效地模拟薄层(如树脂层、介电隔离层和氮化层)来合理地简化TSV结构,这些薄层虽然厚度小,但对传热的影响不容忽视。通过专门的实验对模型进行了验证。研究了五种典型的热源分布场景和不同的微碰撞高度,分析了它们对两相流模式、结温和换热性能的影响。结果表明:微凸包高度为90µm时,结温保持在61.4℃以下,成核更加均匀,平均换热系数约为2327 W/(m2·K);模具之间的热传递变化保持在10.3%以下。本研究为异构3dic的浸入式沸腾冷却提供了一个物理知识丰富、计算效率高、实验验证的框架,为大功率电子系统的节能设计提供了理论指导和可扩展的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimized immersion boiling-based thermal management of heterogeneous three-dimensional integrated circuits
To address the thermal management challenges of high heat flux in 3D integrated circuits (3DICs), this study introduces an immersion boiling-based cooling strategy using HFE-7100 as the working fluid. A thermal-fluid coupled numerical model incorporating a phase-change mechanism based on the critical bubble radius and bubble growth factor is developed to simulate bubble nucleation, growth, and departure. Surface tension and contact angle effects are also included to enhance microscale physical fidelity. A resistance-network-based structural simplification method is introduced to reduce mesh complexity while preserving thermal accuracy, enabling an 81.4 % improvement in computational efficiency. The TSV structure is reasonably simplified by equivalently modeling thin layers such as the resin layer, dielectric isolation layer, and Nitrided layer, which, despite their small thicknesses, have non-negligible effects on heat transfer. The model is validated through dedicated experiments. Five representative heat source distribution scenarios and varying Micro bump heights are investigated to analyze their impact on two-phase flow patterns, junction temperature, and heat transfer performance. Results indicate that a Micro bump height of 90 µm achieves more uniform nucleation and keeps junction temperatures below 61.4 °C, with an average heat transfer coefficient of around 2327 W/(m2·K). The variation in heat transfer across dies is kept below 10.3 %. The present study offers a physics-informed, computationally efficient, and experimentally validated framework for immersion boiling cooling in heterogeneous 3DICs, providing theoretical guidance and a scalable solution for the energy-efficient design of high-power electronic systems.
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来源期刊
CiteScore
10.30
自引率
13.50%
发文量
1319
审稿时长
41 days
期刊介绍: International Journal of Heat and Mass Transfer is the vehicle for the exchange of basic ideas in heat and mass transfer between research workers and engineers throughout the world. It focuses on both analytical and experimental research, with an emphasis on contributions which increase the basic understanding of transfer processes and their application to engineering problems. Topics include: -New methods of measuring and/or correlating transport-property data -Energy engineering -Environmental applications of heat and/or mass transfer
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