{"title":"优化MDT树脂:T/D比和封端剂对性能的影响","authors":"Zhaoqun Pan, Shuangshuang Li, Changxin Cai","doi":"10.1007/s12633-025-03341-4","DOIUrl":null,"url":null,"abstract":"<div><p>In this study, trimethoxyphenylsilane and methylphenyldimethoxysilane were utilized as raw materials, while hexamethyldisiloxane and divinyltetramethyldisiloxane served as capping agents. Vinylphenyl MDT resin was synthesized through two distinct processes: hydroxyl prepolymer capping and vinyl prepolymer dehydroxylation. The investigation focused on the effects of varying T/D ratios, the timing of capping agent addition, and the influence of Hexamethyldisiloxane working as end-capping agents on the mechanical properties, optical properties, and thermal stability of MDT resin. It was found that when T/D = 0.4, the elongation at break of PMDT-2 resin reached 126%. Conversely, at T/D = 0.8, the tensile strength of PMDT-4 resin achieved 5.06 MPa, with a transmittance at 450 nm of 90.8% and a 5% mass loss temperature of 437 °C. The MDT silicone resin prepared via the dehydroxylation of vinyl prepolymer exhibited enhanced control over vinyl content and viscosity. Notably, the vinyl content of PMDT-10 reached 5.33wt%, with a 5% mass loss temperature of 449.1 °C and a tensile strength of 8.52 MPa. This accomplishment has led to the development of an innovative preparation process for MDT resin. The resultant MDT resin exhibits exceptional properties, making it a promising candidate for application in electronic packaging. This advancement offers novel possibilities for material selection within this domain.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 10","pages":"2313 - 2327"},"PeriodicalIF":3.3000,"publicationDate":"2025-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Optimizing MDT Resin: The Impact of T/D Ratios and End-capping Agents on Performance\",\"authors\":\"Zhaoqun Pan, Shuangshuang Li, Changxin Cai\",\"doi\":\"10.1007/s12633-025-03341-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>In this study, trimethoxyphenylsilane and methylphenyldimethoxysilane were utilized as raw materials, while hexamethyldisiloxane and divinyltetramethyldisiloxane served as capping agents. Vinylphenyl MDT resin was synthesized through two distinct processes: hydroxyl prepolymer capping and vinyl prepolymer dehydroxylation. The investigation focused on the effects of varying T/D ratios, the timing of capping agent addition, and the influence of Hexamethyldisiloxane working as end-capping agents on the mechanical properties, optical properties, and thermal stability of MDT resin. It was found that when T/D = 0.4, the elongation at break of PMDT-2 resin reached 126%. Conversely, at T/D = 0.8, the tensile strength of PMDT-4 resin achieved 5.06 MPa, with a transmittance at 450 nm of 90.8% and a 5% mass loss temperature of 437 °C. The MDT silicone resin prepared via the dehydroxylation of vinyl prepolymer exhibited enhanced control over vinyl content and viscosity. Notably, the vinyl content of PMDT-10 reached 5.33wt%, with a 5% mass loss temperature of 449.1 °C and a tensile strength of 8.52 MPa. This accomplishment has led to the development of an innovative preparation process for MDT resin. The resultant MDT resin exhibits exceptional properties, making it a promising candidate for application in electronic packaging. This advancement offers novel possibilities for material selection within this domain.</p></div>\",\"PeriodicalId\":776,\"journal\":{\"name\":\"Silicon\",\"volume\":\"17 10\",\"pages\":\"2313 - 2327\"},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2025-05-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Silicon\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s12633-025-03341-4\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03341-4","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Optimizing MDT Resin: The Impact of T/D Ratios and End-capping Agents on Performance
In this study, trimethoxyphenylsilane and methylphenyldimethoxysilane were utilized as raw materials, while hexamethyldisiloxane and divinyltetramethyldisiloxane served as capping agents. Vinylphenyl MDT resin was synthesized through two distinct processes: hydroxyl prepolymer capping and vinyl prepolymer dehydroxylation. The investigation focused on the effects of varying T/D ratios, the timing of capping agent addition, and the influence of Hexamethyldisiloxane working as end-capping agents on the mechanical properties, optical properties, and thermal stability of MDT resin. It was found that when T/D = 0.4, the elongation at break of PMDT-2 resin reached 126%. Conversely, at T/D = 0.8, the tensile strength of PMDT-4 resin achieved 5.06 MPa, with a transmittance at 450 nm of 90.8% and a 5% mass loss temperature of 437 °C. The MDT silicone resin prepared via the dehydroxylation of vinyl prepolymer exhibited enhanced control over vinyl content and viscosity. Notably, the vinyl content of PMDT-10 reached 5.33wt%, with a 5% mass loss temperature of 449.1 °C and a tensile strength of 8.52 MPa. This accomplishment has led to the development of an innovative preparation process for MDT resin. The resultant MDT resin exhibits exceptional properties, making it a promising candidate for application in electronic packaging. This advancement offers novel possibilities for material selection within this domain.
期刊介绍:
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.