优化MDT树脂:T/D比和封端剂对性能的影响

IF 3.3 3区 材料科学 Q3 CHEMISTRY, PHYSICAL
Silicon Pub Date : 2025-05-26 DOI:10.1007/s12633-025-03341-4
Zhaoqun Pan, Shuangshuang Li, Changxin Cai
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引用次数: 0

摘要

本研究以三甲氧基苯基硅烷和甲基苯基二甲氧基硅烷为原料,六甲基二硅氧烷和二乙烯基四甲基二硅氧烷为封盖剂。乙烯基苯基MDT树脂的合成采用了两种不同的工艺:羟基预聚物盖顶和乙烯基预聚物脱羟基。研究了不同的T/D比、旋盖剂的加入时间以及六甲基二硅氧烷作为旋盖剂对MDT树脂的力学性能、光学性能和热稳定性的影响。结果表明,当T/D = 0.4时,PMDT-2树脂的断裂伸长率达到126%。相反,当T/D = 0.8时,PMDT-4树脂的抗拉强度达到5.06 MPa,在450 nm处透光率为90.8%,失重温度为437℃,为5%。乙烯基预聚物脱羟基制备的MDT有机硅树脂对乙烯基含量和粘度的控制能力增强。值得注意的是,PMDT-10的乙烯基含量达到5.33wt%,失重温度为449.1℃,失重温度为5%,抗拉强度为8.52 MPa。这一成就导致了MDT树脂的创新制备工艺的发展。由此产生的MDT树脂表现出优异的性能,使其成为电子封装应用的有希望的候选者。这一进展为该领域的材料选择提供了新的可能性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimizing MDT Resin: The Impact of T/D Ratios and End-capping Agents on Performance

In this study, trimethoxyphenylsilane and methylphenyldimethoxysilane were utilized as raw materials, while hexamethyldisiloxane and divinyltetramethyldisiloxane served as capping agents. Vinylphenyl MDT resin was synthesized through two distinct processes: hydroxyl prepolymer capping and vinyl prepolymer dehydroxylation. The investigation focused on the effects of varying T/D ratios, the timing of capping agent addition, and the influence of Hexamethyldisiloxane working as end-capping agents on the mechanical properties, optical properties, and thermal stability of MDT resin. It was found that when T/D = 0.4, the elongation at break of PMDT-2 resin reached 126%. Conversely, at T/D = 0.8, the tensile strength of PMDT-4 resin achieved 5.06 MPa, with a transmittance at 450 nm of 90.8% and a 5% mass loss temperature of 437 °C. The MDT silicone resin prepared via the dehydroxylation of vinyl prepolymer exhibited enhanced control over vinyl content and viscosity. Notably, the vinyl content of PMDT-10 reached 5.33wt%, with a 5% mass loss temperature of 449.1 °C and a tensile strength of 8.52 MPa. This accomplishment has led to the development of an innovative preparation process for MDT resin. The resultant MDT resin exhibits exceptional properties, making it a promising candidate for application in electronic packaging. This advancement offers novel possibilities for material selection within this domain.

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来源期刊
Silicon
Silicon CHEMISTRY, PHYSICAL-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
5.90
自引率
20.60%
发文量
685
审稿时长
>12 weeks
期刊介绍: The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.
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