{"title":"激光诱导夹层半导体复合材料动态响应的分数阶光热弹性模型","authors":"Chenlin Li, Jiaxi Zhou, Tianhu He","doi":"10.1007/s12633-025-03365-w","DOIUrl":null,"url":null,"abstract":"<div><p>Laser heating technology as new hyperfine-precision approach which has been widely applied in the micro-machining of the sandwich laminated semiconductor composites (SLSC), where the memory-dependency of the strain and heat transport significantly increases. To accurately predict the micro-scale transient impact response of SLSC subjected to the non-Gaussian laser beam, a new Cattaneo-photo-thermoelastic model is established in this work based on memory-dependent strain and heat transport evolution laws with Atangana-Baleanu and Tempered-Caputo fractional derivatives. This model aims to analyze the influences of memory dependent thermal transport and strain as well as the parameters ratios of inner/outer layer materials on the photo-thermoelastic response and wave propagations in SLSC. The time-domain solutions of the one-dimensional multi-variables partial differential equations are solved via semi-analytical technique based on Laplace transformation. Dimensionless numerical results reveal that the decrease of the memory-dependent parameters of heat transport and strain lower the thermal wave propagation speed and reduce harmful stress and deformation in the SLSC. And the properly selecting parameters of laser intensity, pulse duration and semiconductor parameters ratios maximally improve the photo-thermo-mechanical impact responses and photo-thermal waves.</p></div>","PeriodicalId":776,"journal":{"name":"Silicon","volume":"17 11","pages":"2651 - 2672"},"PeriodicalIF":3.3000,"publicationDate":"2025-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Fractional-order Photo-thermoelastic Model for Laser-induced Dynamic Response in Sandwich Laminated Semiconductor Composites\",\"authors\":\"Chenlin Li, Jiaxi Zhou, Tianhu He\",\"doi\":\"10.1007/s12633-025-03365-w\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Laser heating technology as new hyperfine-precision approach which has been widely applied in the micro-machining of the sandwich laminated semiconductor composites (SLSC), where the memory-dependency of the strain and heat transport significantly increases. To accurately predict the micro-scale transient impact response of SLSC subjected to the non-Gaussian laser beam, a new Cattaneo-photo-thermoelastic model is established in this work based on memory-dependent strain and heat transport evolution laws with Atangana-Baleanu and Tempered-Caputo fractional derivatives. This model aims to analyze the influences of memory dependent thermal transport and strain as well as the parameters ratios of inner/outer layer materials on the photo-thermoelastic response and wave propagations in SLSC. The time-domain solutions of the one-dimensional multi-variables partial differential equations are solved via semi-analytical technique based on Laplace transformation. Dimensionless numerical results reveal that the decrease of the memory-dependent parameters of heat transport and strain lower the thermal wave propagation speed and reduce harmful stress and deformation in the SLSC. And the properly selecting parameters of laser intensity, pulse duration and semiconductor parameters ratios maximally improve the photo-thermo-mechanical impact responses and photo-thermal waves.</p></div>\",\"PeriodicalId\":776,\"journal\":{\"name\":\"Silicon\",\"volume\":\"17 11\",\"pages\":\"2651 - 2672\"},\"PeriodicalIF\":3.3000,\"publicationDate\":\"2025-06-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Silicon\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s12633-025-03365-w\",\"RegionNum\":3,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Silicon","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s12633-025-03365-w","RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Fractional-order Photo-thermoelastic Model for Laser-induced Dynamic Response in Sandwich Laminated Semiconductor Composites
Laser heating technology as new hyperfine-precision approach which has been widely applied in the micro-machining of the sandwich laminated semiconductor composites (SLSC), where the memory-dependency of the strain and heat transport significantly increases. To accurately predict the micro-scale transient impact response of SLSC subjected to the non-Gaussian laser beam, a new Cattaneo-photo-thermoelastic model is established in this work based on memory-dependent strain and heat transport evolution laws with Atangana-Baleanu and Tempered-Caputo fractional derivatives. This model aims to analyze the influences of memory dependent thermal transport and strain as well as the parameters ratios of inner/outer layer materials on the photo-thermoelastic response and wave propagations in SLSC. The time-domain solutions of the one-dimensional multi-variables partial differential equations are solved via semi-analytical technique based on Laplace transformation. Dimensionless numerical results reveal that the decrease of the memory-dependent parameters of heat transport and strain lower the thermal wave propagation speed and reduce harmful stress and deformation in the SLSC. And the properly selecting parameters of laser intensity, pulse duration and semiconductor parameters ratios maximally improve the photo-thermo-mechanical impact responses and photo-thermal waves.
期刊介绍:
The journal Silicon is intended to serve all those involved in studying the role of silicon as an enabling element in materials science. There are no restrictions on disciplinary boundaries provided the focus is on silicon-based materials or adds significantly to the understanding of such materials. Accordingly, such contributions are welcome in the areas of inorganic and organic chemistry, physics, biology, engineering, nanoscience, environmental science, electronics and optoelectronics, and modeling and theory. Relevant silicon-based materials include, but are not limited to, semiconductors, polymers, composites, ceramics, glasses, coatings, resins, composites, small molecules, and thin films.