磁场存在下存储器响应在增强半导体中的光热弹性波传播

IF 2.9 3区 工程技术 Q2 MECHANICS
Sudip Mondal, Abhik Sur, M. Kanoria
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引用次数: 0

摘要

本分析报告研究了在感应磁场影响下二维光纤增强半导体光热输运过程中耦合等离子体、热波和弹性波的传播。在无界弹性半导体广义热弹性三相滞后模型的背景下,提出了一种新的模型,该模型包含了热传递方程中的记忆相关导数。采用拉普拉斯变换和傅立叶变换作为工具,导出了热物理量分布的解析结果。傅里叶变换的数值反演是用Mathematica软件进行的,而拉普拉斯变换的数值反演是用一种基于黎曼和近似技术的合适方案进行的。对光纤增强半导体中的场量进行了数值计算,并以图形方式进行了演示。强化、磁场影响、记忆效应和延时参数对热物理量也有显著影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Photo-thermoelastic wave propagation in a reinforced semiconductor due to memory responses in the presence of magnetic field

The current analysis reports on studying the propagation of coupled plasma, thermal and elastic waves in a two-dimensional fiber-reinforced semiconductor in context of photothermal transport process under the influence of an induced magnetic field. The problem is solved with a new model involving the memory-dependent derivative in the heat transport equation in the context of three-phase lag model of generalized thermoelasticity for an unbounded elastic semiconductor. Employing the Laplace transform and the Fourier transform as tools, the analytical results for the distributions of the thermophysical quantities have been derived. The numerical inversion of the Fourier transforms have been performed using Mathematica software, whereas the numerical inversions of the Laplace transform is carried out using a suitable scheme based on the Riemann-sum approximation technique. Numerical computations for the field quantities in a fiber-reinforced semiconductor is performed and have been demonstrated graphically. Significant effects are observed on the thermophysical quantities due to the presence of reinforcement, influence of magnetic field, memory effect and time-delay parameter also.

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来源期刊
Acta Mechanica
Acta Mechanica 物理-力学
CiteScore
4.30
自引率
14.80%
发文量
292
审稿时长
6.9 months
期刊介绍: Since 1965, the international journal Acta Mechanica has been among the leading journals in the field of theoretical and applied mechanics. In addition to the classical fields such as elasticity, plasticity, vibrations, rigid body dynamics, hydrodynamics, and gasdynamics, it also gives special attention to recently developed areas such as non-Newtonian fluid dynamics, micro/nano mechanics, smart materials and structures, and issues at the interface of mechanics and materials. The journal further publishes papers in such related fields as rheology, thermodynamics, and electromagnetic interactions with fluids and solids. In addition, articles in applied mathematics dealing with significant mechanics problems are also welcome.
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