{"title":"2D材料的机器人转移已经成熟","authors":"Timothy John Booth, Peter Bøggild","doi":"10.1038/s44286-025-00221-x","DOIUrl":null,"url":null,"abstract":"The transfer of 2D materials from growth to device substrates has hampered their scalability. Now, a robotic, solvent-free process promises clean, high-yield and wafer-scale integration.","PeriodicalId":501699,"journal":{"name":"Nature Chemical Engineering","volume":"2 5","pages":"292-293"},"PeriodicalIF":0.0000,"publicationDate":"2025-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Robotic transfer of 2D materials comes of age\",\"authors\":\"Timothy John Booth, Peter Bøggild\",\"doi\":\"10.1038/s44286-025-00221-x\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The transfer of 2D materials from growth to device substrates has hampered their scalability. Now, a robotic, solvent-free process promises clean, high-yield and wafer-scale integration.\",\"PeriodicalId\":501699,\"journal\":{\"name\":\"Nature Chemical Engineering\",\"volume\":\"2 5\",\"pages\":\"292-293\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2025-05-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nature Chemical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.nature.com/articles/s44286-025-00221-x\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nature Chemical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://www.nature.com/articles/s44286-025-00221-x","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The transfer of 2D materials from growth to device substrates has hampered their scalability. Now, a robotic, solvent-free process promises clean, high-yield and wafer-scale integration.
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