基于声流控粒子操作的微颗粒快速分离

IF 4.9 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Meijin Du , Shaoshuai Han , Yangyang Yu , He Li , Di Lian , Honghao Li , Xin Yang , Tangcheng Huang , Jun Ren , Zhenlin Wu
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引用次数: 0

摘要

从复杂混合物中精确分离颗粒和细胞是各种诊断和治疗应用的基本技术。在这项研究中,介绍了一种高效、无创的声镊子方法,用于在表面声波(SAW)驱动下的无底液滴内进行颗粒分离。通过改变实验中两个典型的声学参数,即驱动频率和位置偏移因子,生成了三种粒子分布模型。采用直径为1 ~ 40 μm的颗粒进行浓度分布实验。结果表明,中心富集的粒子团与外围的同心圆粒子环能够以平衡状态共存,提示了新的粒子操纵可能性。此外,颗粒将集中在液滴的中心(C1)或液滴的周围(C3)。通过调节声学参数,颗粒被选择性地集中在无底液滴中,在短时间内(~ 30 s)实现了复杂混合物(5 μm和40 μm, 5 μm和30 μm)中基于颗粒大小的精确分离。由于其非侵入性和处理大范围粒度的能力,这种声学分离方法比传统技术具有显著的优势。根据粒子的物理性质选择性地操纵粒子的能力为精确和可扩展的粒子分类和净化开辟了新的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Rapid microparticle separation based on acoustofluidic particle manipulation inside a sessile droplet

Rapid microparticle separation based on acoustofluidic particle manipulation inside a sessile droplet
The precise separation of particles and cells from complex mixtures is a fundamental technique in various diagnostic and therapeutic applications. In this study, a highly efficient, non-invasive acoustic tweezers method for particle separation within a sessile droplet driven by surface acoustic waves (SAW) was introduced. By changing two typical acoustic parameters in the experiment, including the actuation frequency and the position offset factor, three particle distribution models were generated. Concentration distribution experiments were conducted using particles of 1-40 μm diameters. It was observed that the particle cluster enriched in the center and the concentric particle ring in the outer area could co-exist in a balanced state (C2), suggesting new particle manipulation possibilities. Also, the particles would concentrate at the center of the droplet (C1) or around the periphery of the droplet (C3). By adjusting acoustic parameters, particles were selectively concentrated in the sessile droplet, enabling precise separation based on particle size in complex mixtures (5 μm and 40 μm, 5 μm and 30 μm) in a short time (30 s). This acoustic separation method offers significant advantages over traditional techniques, due to its non-invasive nature and the ability to handle a wide range of particle sizes. The ability to selectively manipulate particles based on their physical properties opens new avenues for precise and scalable particle sorting and purification.
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来源期刊
Sensors and Actuators A-physical
Sensors and Actuators A-physical 工程技术-工程:电子与电气
CiteScore
8.10
自引率
6.50%
发文量
630
审稿时长
49 days
期刊介绍: Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas: • Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results. • Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon. • Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays. • Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers. Etc...
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