通过提高聚氨酯复合材料导热性的简单策略构建“片状球”网络结构

IF 4.6 3区材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials Science and Engineering: B Pub Date : 2025-09-22 DOI:10.1016/j.mseb.2025.118799

Lei Ma, Shuyan Xu

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引用次数: 0

摘要

为了满足5G/大功率电子器件的热管理需求，克服传统聚合物复合材料的工艺限制，采用医生叶片法制备了PDA-BNNSs/APTES-Al2O3/CNF/WPU （BACW）复合材料。在恒定的总负载下，将聚多巴胺功能化的BNNSs （PDA-BNNSs）和APTES-Al2O3接枝的Al2O3 （APTES-Al2O3）结合在一起，形成了一种具有调制质量比的混合填料体系。纤维素纳米纤维（CNF）实现了界面桥接和剪切流诱导组装，在水性聚氨酯（WPU）中构建了三维互穿的“片状球”热网络。在PDA-BNNSs/APTES-Al2O3比例为1:25时，BACW复合材料的通平面导热系数（TC）为0.712±0.0068 W/(m·K)，比纯WPU（0.186±0.0084 W/(m·K)）提高了282.8%，优于无cnf的BAW复合材料（0.621±0.0139 W/(m·K)）。有限元仿真验证了这些结果。作为led的热界面材料，BACW在1分钟内将峰值温度降低到57°C（相比之下，WPU的峰值温度为74.2°C），并加速了冷却。这种“界面修改-结构设计-工艺优化”的协同作用为工程应用的高导热导热界面材料（TIMs）提供了一个范例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Constructing “flake-ball” network architectures via facile strategies for enhanced thermal conductivity in polyurethane composites

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Constructing “flake-ball” network architectures via facile strategies for enhanced thermal conductivity in polyurethane composites

To meet thermal management demands of 5G/high-power electronics and overcome the processing limitations of conventional polymer composites, we fabricated PDA-BNNSs/APTES-Al₂O₃/CNF/WPU (BACW) composites via doctor-blade method. A hybrid filler system with modulated mass ratios (at constant total loading) combined polydopamine-functionalized BNNSs (PDA-BNNSs) and APTES-grafted Al₂O₃ (APTES-Al₂O₃). Cellulose nanofiber (CNF) enabled interfacial bridging and shear-flow-induced assembly, constructing a 3D interpenetrating “flake-ball” thermal network within waterborne polyurethane (WPU). At a PDA-BNNSs/APTES-Al₂O₃ ratio of 1:2.5, the BACW composite achieved a through-plane thermal conductivity (TC) of 0.712 ± 0.0068 W/(m·K) − a 282.8 % enhancement compared to pure WPU (0.186 ± 0.0084 W/(m·K)) − and outperformed the CNF-free BAW composite (0.621 ± 0.0139 W/(m·K)). Finite element simulations validated these results. As a thermal interface material for LEDs, BACW reduced the peak temperature to 57 °C (compared to 74.2 °C for WPU) within 1 min and accelerated cooling. This synergy of “interface modification-structure design-process optimization” provides a paradigm for engineering applicable high-thermal-conductivity thermal interface materials (TIMs).

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来源期刊

Materials Science and Engineering: B 工程技术-材料科学：综合

CiteScore

5.60

自引率

2.80%

发文量

481

审稿时长

3.5 months

期刊介绍： The journal provides an international medium for the publication of theoretical and experimental studies and reviews related to the electronic, electrochemical, ionic, magnetic, optical, and biosensing properties of solid state materials in bulk, thin film and particulate forms. Papers dealing with synthesis, processing, characterization, structure, physical properties and computational aspects of nano-crystalline, crystalline, amorphous and glassy forms of ceramics, semiconductors, layered insertion compounds, low-dimensional compounds and systems, fast-ion conductors, polymers and dielectrics are viewed as suitable for publication. Articles focused on nano-structured aspects of these advanced solid-state materials will also be considered suitable.