{"title":"具有环氧树脂热延迟和应力消除性能的双功能远旋硅酸磷促进剂","authors":"Yongjia Yu, , , Xin Yang*, , , Shanxue Wang, , , Gang Li, , , Qianfa Liu, , , Naidong She, , , Dongliang Liu, , and , Wei Huang*, ","doi":"10.1021/acs.chemmater.5c01933","DOIUrl":null,"url":null,"abstract":"<p >The chemorheological and internal stress control of epoxy resins is critical for improving the reliability of advanced packaging. Here, a series of dual-functional thermal latent accelerators, tetraphenylphosphonium bis (2,3-dioxy-naphthalene)(3-(ethylthio)propyl)silicate-terminated polymethylphenylsiloxane (P-PMPSi<sub>n</sub>), were designed and synthesized to improve the curing and internal stress management of epoxy packaging materials. A comprehensive investigation was conducted to evaluate the catalytic activity of these P-PMPSi<sub>n</sub> accelerators in epoxy/phenolic resin systems, along with their effects on the thermal and mechanical properties and internal stress performance of the cured resins. Comparative analyses were performed against monomeric accelerators, triphenyl phosphine (TPP) and tetraphenylphosphonium bis(2,3-dioxy-naphthalene)methylsilicate (P-Si-Me), and the commodity stress-relief additive, carboxyl-terminated butadiene–acrylonitrile liquid rubber (CTBN). It was found that the ionic phosphonium silicate moiety in P-PMPSi<sub>n</sub> accelerators resulted in their latency and catalytic activities comparable to those of the monomeric phosphonium silicate accelerator P-Si-Me. Notably, P-PMPSi<sub>n</sub> accelerators exhibited delayed gelation in the uncured epoxy while simultaneously enhancing the cross-link density and glass-transition temperature (<i>T</i><sub>g</sub>) of the cured resins compared to the commercially available TPP accelerator. Meanwhile, the incorporation of flexible polymethylphenylsiloxane segments in P-PMPSi<sub>n</sub> accelerators significantly reduced the elastic modulus and internal stress in the cured resins relative to the monomeric accelerator systems and CTBN-modified formulation. The stress-relieving mechanism was attributed to the formation of a dispersed polysiloxane particle phase within the epoxy matrix, which effectively mitigated internal stresses through enhanced molecular mobility and phase separation.</p>","PeriodicalId":33,"journal":{"name":"Chemistry of Materials","volume":"37 18","pages":"7471–7483"},"PeriodicalIF":7.0000,"publicationDate":"2025-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Dual-Functional Telechelic Phosphonium Silicate Accelerators with Thermal Latency and Stress-Relieving Properties for Epoxy Resin\",\"authors\":\"Yongjia Yu, , , Xin Yang*, , , Shanxue Wang, , , Gang Li, , , Qianfa Liu, , , Naidong She, , , Dongliang Liu, , and , Wei Huang*, \",\"doi\":\"10.1021/acs.chemmater.5c01933\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<p >The chemorheological and internal stress control of epoxy resins is critical for improving the reliability of advanced packaging. Here, a series of dual-functional thermal latent accelerators, tetraphenylphosphonium bis (2,3-dioxy-naphthalene)(3-(ethylthio)propyl)silicate-terminated polymethylphenylsiloxane (P-PMPSi<sub>n</sub>), were designed and synthesized to improve the curing and internal stress management of epoxy packaging materials. A comprehensive investigation was conducted to evaluate the catalytic activity of these P-PMPSi<sub>n</sub> accelerators in epoxy/phenolic resin systems, along with their effects on the thermal and mechanical properties and internal stress performance of the cured resins. Comparative analyses were performed against monomeric accelerators, triphenyl phosphine (TPP) and tetraphenylphosphonium bis(2,3-dioxy-naphthalene)methylsilicate (P-Si-Me), and the commodity stress-relief additive, carboxyl-terminated butadiene–acrylonitrile liquid rubber (CTBN). It was found that the ionic phosphonium silicate moiety in P-PMPSi<sub>n</sub> accelerators resulted in their latency and catalytic activities comparable to those of the monomeric phosphonium silicate accelerator P-Si-Me. Notably, P-PMPSi<sub>n</sub> accelerators exhibited delayed gelation in the uncured epoxy while simultaneously enhancing the cross-link density and glass-transition temperature (<i>T</i><sub>g</sub>) of the cured resins compared to the commercially available TPP accelerator. Meanwhile, the incorporation of flexible polymethylphenylsiloxane segments in P-PMPSi<sub>n</sub> accelerators significantly reduced the elastic modulus and internal stress in the cured resins relative to the monomeric accelerator systems and CTBN-modified formulation. The stress-relieving mechanism was attributed to the formation of a dispersed polysiloxane particle phase within the epoxy matrix, which effectively mitigated internal stresses through enhanced molecular mobility and phase separation.</p>\",\"PeriodicalId\":33,\"journal\":{\"name\":\"Chemistry of Materials\",\"volume\":\"37 18\",\"pages\":\"7471–7483\"},\"PeriodicalIF\":7.0000,\"publicationDate\":\"2025-09-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Chemistry of Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://pubs.acs.org/doi/10.1021/acs.chemmater.5c01933\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"CHEMISTRY, PHYSICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Chemistry of Materials","FirstCategoryId":"88","ListUrlMain":"https://pubs.acs.org/doi/10.1021/acs.chemmater.5c01933","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, PHYSICAL","Score":null,"Total":0}
Dual-Functional Telechelic Phosphonium Silicate Accelerators with Thermal Latency and Stress-Relieving Properties for Epoxy Resin
The chemorheological and internal stress control of epoxy resins is critical for improving the reliability of advanced packaging. Here, a series of dual-functional thermal latent accelerators, tetraphenylphosphonium bis (2,3-dioxy-naphthalene)(3-(ethylthio)propyl)silicate-terminated polymethylphenylsiloxane (P-PMPSin), were designed and synthesized to improve the curing and internal stress management of epoxy packaging materials. A comprehensive investigation was conducted to evaluate the catalytic activity of these P-PMPSin accelerators in epoxy/phenolic resin systems, along with their effects on the thermal and mechanical properties and internal stress performance of the cured resins. Comparative analyses were performed against monomeric accelerators, triphenyl phosphine (TPP) and tetraphenylphosphonium bis(2,3-dioxy-naphthalene)methylsilicate (P-Si-Me), and the commodity stress-relief additive, carboxyl-terminated butadiene–acrylonitrile liquid rubber (CTBN). It was found that the ionic phosphonium silicate moiety in P-PMPSin accelerators resulted in their latency and catalytic activities comparable to those of the monomeric phosphonium silicate accelerator P-Si-Me. Notably, P-PMPSin accelerators exhibited delayed gelation in the uncured epoxy while simultaneously enhancing the cross-link density and glass-transition temperature (Tg) of the cured resins compared to the commercially available TPP accelerator. Meanwhile, the incorporation of flexible polymethylphenylsiloxane segments in P-PMPSin accelerators significantly reduced the elastic modulus and internal stress in the cured resins relative to the monomeric accelerator systems and CTBN-modified formulation. The stress-relieving mechanism was attributed to the formation of a dispersed polysiloxane particle phase within the epoxy matrix, which effectively mitigated internal stresses through enhanced molecular mobility and phase separation.
期刊介绍:
The journal Chemistry of Materials focuses on publishing original research at the intersection of materials science and chemistry. The studies published in the journal involve chemistry as a prominent component and explore topics such as the design, synthesis, characterization, processing, understanding, and application of functional or potentially functional materials. The journal covers various areas of interest, including inorganic and organic solid-state chemistry, nanomaterials, biomaterials, thin films and polymers, and composite/hybrid materials. The journal particularly seeks papers that highlight the creation or development of innovative materials with novel optical, electrical, magnetic, catalytic, or mechanical properties. It is essential that manuscripts on these topics have a primary focus on the chemistry of materials and represent a significant advancement compared to prior research. Before external reviews are sought, submitted manuscripts undergo a review process by a minimum of two editors to ensure their appropriateness for the journal and the presence of sufficient evidence of a significant advance that will be of broad interest to the materials chemistry community.