高密度光子开关阵列用3D玻璃基EIC-PIC封装实现高能效热光开关

IF 2.4 4区工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Photonics Journal Pub Date : 2025-09-09 DOI:10.1109/JPHOT.2025.3607966

Zhonghua Yang;Qingji Zhao;Yuchi Yang;Guopeng He;Guosheng Yan;Songxuan Liu;Yufeng Li;Yu Sun;Wenbo Luo;Wanli Zhang

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引用次数: 0

摘要

热光（TO）开关是集成光子电路（PICs）的重要组成部分，但由于其高导热性，其效率受到硅衬底大量散热的限制。本研究提出一种基于3D玻璃基EIC-PIC封装的高能效TO开关解决方案。通过利用玻璃中间层的低导热性，加热器效率显著提高。有限元模拟表明，与传统表面贴装PIC相比，混合键合PIC的加热效率提高了3.43倍，达到947.7 pm/mW。对于通孔间距为100 μm的开关阵列，归一化热串扰保持在6%以下。对于5mm × 5mm的PIC，其面外翘曲小于1 μm。这种3D集成策略为高密度光子开关提供了一个可扩展和节能的平台，解决了大规模光学系统中的关键挑战。

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Energy-Efficient Thermo-Optic Switches Enabled by 3D Glass-Based EIC–PIC Packaging for High-Density Photonic Switch Arrays

Thermo-optic (TO) switches are essential components in integrated photonic circuits (PICs), but their efficiency is limited by significant heat dissipation into the silicon substrate due to its high thermal conductivity. This study presents an energy-efficient TO switching solution based on 3D glass-based EIC–PIC packaging. By leveraging the low thermal conductivity of a glass interposer, the heater efficiency is significantly enhanced. Finite element simulations show that the hybrid-bonded PIC achieves a 3.43 times improvement in heater efficiency compared to conventional surface-mounted PICs, reaching 947.7 pm/mW. For a switch array with a through-glass via pitch of 100 μm, the normalized thermal crosstalk remains below 6% . The out-of-plane warpage is less than 1 μm for a 5 mm × 5 mm PIC. This 3D integration strategy provides a scalable and energy-efficient platform for high-density photonic switching, addressing key challenges in large-scale optical systems.

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来源期刊

IEEE Photonics Journal ENGINEERING, ELECTRICAL & ELECTRONIC-OPTICS

CiteScore

4.50

自引率

8.30%

发文量

489

审稿时长

1.4 months

期刊介绍： Breakthroughs in the generation of light and in its control and utilization have given rise to the field of Photonics, a rapidly expanding area of science and technology with major technological and economic impact. Photonics integrates quantum electronics and optics to accelerate progress in the generation of novel photon sources and in their utilization in emerging applications at the micro and nano scales spanning from the far-infrared/THz to the x-ray region of the electromagnetic spectrum. IEEE Photonics Journal is an online-only journal dedicated to the rapid disclosure of top-quality peer-reviewed research at the forefront of all areas of photonics. Contributions addressing issues ranging from fundamental understanding to emerging technologies and applications are within the scope of the Journal. The Journal includes topics in: Photon sources from far infrared to X-rays, Photonics materials and engineered photonic structures, Integrated optics and optoelectronic, Ultrafast, attosecond, high field and short wavelength photonics, Biophotonics, including DNA photonics, Nanophotonics, Magnetophotonics, Fundamentals of light propagation and interaction; nonlinear effects, Optical data storage, Fiber optics and optical communications devices, systems, and technologies, Micro Opto Electro Mechanical Systems (MOEMS), Microwave photonics, Optical Sensors.