Shixiang Zhou , Yijing Zhao , Xiao Guo , Udeshwari Jamwal , Pon Janani Sugumaran , Sreekanth Ginnaram , Wentao Yan , Jun Ding , Yong Yang
{"title":"耐腐蚀和散热SiOC超轻晶格高温电磁干扰屏蔽","authors":"Shixiang Zhou , Yijing Zhao , Xiao Guo , Udeshwari Jamwal , Pon Janani Sugumaran , Sreekanth Ginnaram , Wentao Yan , Jun Ding , Yong Yang","doi":"10.1016/j.addma.2025.104964","DOIUrl":null,"url":null,"abstract":"<div><div>High-temperature electromagnetic interference (EMI) shielding material is essential for intense thermal or electromagnetic radiation applications. Ceramics are promising candidates but are often fabricated with increased density and thickness to achieve sufficient shielding effectiveness (SE). However, we present an unconventional strategy to enhance the SE of ceramics by reducing density realized through hierarchical lattice design. 3D-printed silicon oxycarbide (SiOC) with self-arrayed and corrosion-resistant carbon nanosheets was employed to materialize this design. As the density decreases from 2.73 to 0.53 g/cm<sup>3</sup>, the SE increases from 12.53 to 27.27 dB. The combined effects of densely arrayed carbon nanosheets and hierarchical design amplify multi-reflection/scattering, enabling enhanced EMI shielding at reduced density. Furthermore, this structure is capable of operation at 600 °C and oxygen corrosion environment even at an ultralow density of 0.29 g/cm<sup>3</sup>, achieving over 99 % shielding efficiency. It exhibits a low thermal expansion coefficient of 1.41 × 10<sup>−6</sup>/K at 600 °C, along with compressive strength, Young’s modulus, and energy absorption of 6.38 MPa, 3.02 GPa, and 8.14 kJ/cm<sup>3</sup>, respectively, ensuring mechanical, dimensional, and shielding robustness. The interconnected hollow spaces and exposed surfaces facilitate both active and passive heat dissipation, preventing thermal failure and extending the operational lifespan. Under airflow, the heated structure cools to 46.6 °C within 25 s, effectively reducing the operating temperature. This strategy provides a straightforward approach for fabricating high-temperature and lightweight EMI shielding ceramics through structural optimization, underscoring its potential for performance enhancement, cost reduction, and application expansion for extreme environments.</div></div>","PeriodicalId":7172,"journal":{"name":"Additive manufacturing","volume":"111 ","pages":"Article 104964"},"PeriodicalIF":11.1000,"publicationDate":"2025-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Corrosion-resistant and heat-dissipative SiOC ultralight lattice for high-temperature EMI shielding\",\"authors\":\"Shixiang Zhou , Yijing Zhao , Xiao Guo , Udeshwari Jamwal , Pon Janani Sugumaran , Sreekanth Ginnaram , Wentao Yan , Jun Ding , Yong Yang\",\"doi\":\"10.1016/j.addma.2025.104964\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>High-temperature electromagnetic interference (EMI) shielding material is essential for intense thermal or electromagnetic radiation applications. Ceramics are promising candidates but are often fabricated with increased density and thickness to achieve sufficient shielding effectiveness (SE). However, we present an unconventional strategy to enhance the SE of ceramics by reducing density realized through hierarchical lattice design. 3D-printed silicon oxycarbide (SiOC) with self-arrayed and corrosion-resistant carbon nanosheets was employed to materialize this design. As the density decreases from 2.73 to 0.53 g/cm<sup>3</sup>, the SE increases from 12.53 to 27.27 dB. The combined effects of densely arrayed carbon nanosheets and hierarchical design amplify multi-reflection/scattering, enabling enhanced EMI shielding at reduced density. Furthermore, this structure is capable of operation at 600 °C and oxygen corrosion environment even at an ultralow density of 0.29 g/cm<sup>3</sup>, achieving over 99 % shielding efficiency. It exhibits a low thermal expansion coefficient of 1.41 × 10<sup>−6</sup>/K at 600 °C, along with compressive strength, Young’s modulus, and energy absorption of 6.38 MPa, 3.02 GPa, and 8.14 kJ/cm<sup>3</sup>, respectively, ensuring mechanical, dimensional, and shielding robustness. The interconnected hollow spaces and exposed surfaces facilitate both active and passive heat dissipation, preventing thermal failure and extending the operational lifespan. Under airflow, the heated structure cools to 46.6 °C within 25 s, effectively reducing the operating temperature. This strategy provides a straightforward approach for fabricating high-temperature and lightweight EMI shielding ceramics through structural optimization, underscoring its potential for performance enhancement, cost reduction, and application expansion for extreme environments.</div></div>\",\"PeriodicalId\":7172,\"journal\":{\"name\":\"Additive manufacturing\",\"volume\":\"111 \",\"pages\":\"Article 104964\"},\"PeriodicalIF\":11.1000,\"publicationDate\":\"2025-08-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Additive manufacturing\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S2214860425003288\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"ENGINEERING, MANUFACTURING\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Additive manufacturing","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S2214860425003288","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
Corrosion-resistant and heat-dissipative SiOC ultralight lattice for high-temperature EMI shielding
High-temperature electromagnetic interference (EMI) shielding material is essential for intense thermal or electromagnetic radiation applications. Ceramics are promising candidates but are often fabricated with increased density and thickness to achieve sufficient shielding effectiveness (SE). However, we present an unconventional strategy to enhance the SE of ceramics by reducing density realized through hierarchical lattice design. 3D-printed silicon oxycarbide (SiOC) with self-arrayed and corrosion-resistant carbon nanosheets was employed to materialize this design. As the density decreases from 2.73 to 0.53 g/cm3, the SE increases from 12.53 to 27.27 dB. The combined effects of densely arrayed carbon nanosheets and hierarchical design amplify multi-reflection/scattering, enabling enhanced EMI shielding at reduced density. Furthermore, this structure is capable of operation at 600 °C and oxygen corrosion environment even at an ultralow density of 0.29 g/cm3, achieving over 99 % shielding efficiency. It exhibits a low thermal expansion coefficient of 1.41 × 10−6/K at 600 °C, along with compressive strength, Young’s modulus, and energy absorption of 6.38 MPa, 3.02 GPa, and 8.14 kJ/cm3, respectively, ensuring mechanical, dimensional, and shielding robustness. The interconnected hollow spaces and exposed surfaces facilitate both active and passive heat dissipation, preventing thermal failure and extending the operational lifespan. Under airflow, the heated structure cools to 46.6 °C within 25 s, effectively reducing the operating temperature. This strategy provides a straightforward approach for fabricating high-temperature and lightweight EMI shielding ceramics through structural optimization, underscoring its potential for performance enhancement, cost reduction, and application expansion for extreme environments.
期刊介绍:
Additive Manufacturing stands as a peer-reviewed journal dedicated to delivering high-quality research papers and reviews in the field of additive manufacturing, serving both academia and industry leaders. The journal's objective is to recognize the innovative essence of additive manufacturing and its diverse applications, providing a comprehensive overview of current developments and future prospects.
The transformative potential of additive manufacturing technologies in product design and manufacturing is poised to disrupt traditional approaches. In response to this paradigm shift, a distinctive and comprehensive publication outlet was essential. Additive Manufacturing fulfills this need, offering a platform for engineers, materials scientists, and practitioners across academia and various industries to document and share innovations in these evolving technologies.