Microstructural characteristics and properties of dual-heterogeneous layered Cu/Cu-Ag-HEA composites

Achieving concurrent enhancement of strength and electrical conductivity in copper-based composites remains a longstanding challenge due to their intrinsic trade-off. In this study, dual-heterogeneous layered Cu/Cu–6 %Ag–HEA composites were fabricated by accumulative roll bonding (ARB), incorporating 1 wt % and 3 w % high-entropy alloy (HEA) powders. The Cu/Cu–6 %Ag–3 %HEA composite exhibited an optimal property balance, achieving a tensile strength of 558 MPa, uniform elongation of 16 %, and electrical conductivity of 81 % IACS. Detailed microstructural characterization revealed that the superior performance arises from the synergistic effects of alternating heterogeneous layers, uniformly dispersed HEA and Ag nanoparticles, continuous electron transport networks, and reduced electron-scattering interfaces. This layered architecture effectively alleviates the conventional strength–conductivity dilemma in copper alloys. The present work not only demonstrates a simultaneous improvement in strength–ductility and strength–conductivity combinations but also establishes a new design strategy for advanced Cu-based layered composites.