Manuel C.J. Schachinger , Francisco A. Delfin , Bernhard Fickl , Bernhard C. Bayer , Andreas Karner , Johannes Preiner , Christian Forsich , Daniel Heim , Bernd Rübig , Christian Dipolt , Thomas Müller
{"title":"通过直流PACVD在高温下沉积高导电性和厚的a-C:H:N薄膜","authors":"Manuel C.J. Schachinger , Francisco A. Delfin , Bernhard Fickl , Bernhard C. Bayer , Andreas Karner , Johannes Preiner , Christian Forsich , Daniel Heim , Bernd Rübig , Christian Dipolt , Thomas Müller","doi":"10.1016/j.surfcoat.2025.132669","DOIUrl":null,"url":null,"abstract":"<div><div>DLC films exhibit high hardness, low friction coefficient and chemical inertness but generally lack sufficient electrical conductivity. To achieve conductive films with substantial thickness, the combination of direct current plasma assisted chemical vapour deposition (DC PACVD) with high coating temperatures has proven to be effective. Nitrogen doping of DLC films, a common method for improving their electrical conduction properties, typically leads to enhanced graphitization and a reduction in hardness and Young's modulus in harder DLC coatings. This study examines how nitrogen doping affects the mechanical and electrical properties of already unusually conductive, soft and thick (> 25 μm) a-C:H films deposited at elevated temperatures using pulsed direct current PACVD. The a-C:H:N films were grown using C<sub>2</sub>H<sub>2</sub> at 450 °C and 550 °C with an addition of 0–63 vol.-% N<sub>2</sub> to the gas phase and studied subsequently. Nitrogen modification of the a-C:H was highly effective at enhancing mechanical properties in conjunction with electrical conductivity. Hardness and Young's modulus increased by up to 48 % and 95 %, respectively, compared to the undoped films. Relative load bearing capacity improved by up to a factor of 3.7. Specific electrical resistance decreased by more than two orders of magnitude for films deposited at 450 °C and by a factor of four for deposition at 550 °C, approximating and even surpassing the conductivity of graphite electrodes. Conversely, film thickness and deposition rate decreased significantly due to etching effects compared to the undoped a-C:H.</div></div>","PeriodicalId":22009,"journal":{"name":"Surface & Coatings Technology","volume":"515 ","pages":"Article 132669"},"PeriodicalIF":6.1000,"publicationDate":"2025-09-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Highly conductive and thick a-C:H:N films deposited at elevated temperatures via direct current PACVD\",\"authors\":\"Manuel C.J. Schachinger , Francisco A. Delfin , Bernhard Fickl , Bernhard C. Bayer , Andreas Karner , Johannes Preiner , Christian Forsich , Daniel Heim , Bernd Rübig , Christian Dipolt , Thomas Müller\",\"doi\":\"10.1016/j.surfcoat.2025.132669\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>DLC films exhibit high hardness, low friction coefficient and chemical inertness but generally lack sufficient electrical conductivity. To achieve conductive films with substantial thickness, the combination of direct current plasma assisted chemical vapour deposition (DC PACVD) with high coating temperatures has proven to be effective. Nitrogen doping of DLC films, a common method for improving their electrical conduction properties, typically leads to enhanced graphitization and a reduction in hardness and Young's modulus in harder DLC coatings. This study examines how nitrogen doping affects the mechanical and electrical properties of already unusually conductive, soft and thick (> 25 μm) a-C:H films deposited at elevated temperatures using pulsed direct current PACVD. The a-C:H:N films were grown using C<sub>2</sub>H<sub>2</sub> at 450 °C and 550 °C with an addition of 0–63 vol.-% N<sub>2</sub> to the gas phase and studied subsequently. Nitrogen modification of the a-C:H was highly effective at enhancing mechanical properties in conjunction with electrical conductivity. Hardness and Young's modulus increased by up to 48 % and 95 %, respectively, compared to the undoped films. Relative load bearing capacity improved by up to a factor of 3.7. Specific electrical resistance decreased by more than two orders of magnitude for films deposited at 450 °C and by a factor of four for deposition at 550 °C, approximating and even surpassing the conductivity of graphite electrodes. Conversely, film thickness and deposition rate decreased significantly due to etching effects compared to the undoped a-C:H.</div></div>\",\"PeriodicalId\":22009,\"journal\":{\"name\":\"Surface & Coatings Technology\",\"volume\":\"515 \",\"pages\":\"Article 132669\"},\"PeriodicalIF\":6.1000,\"publicationDate\":\"2025-09-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Surface & Coatings Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0257897225009430\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, COATINGS & FILMS\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Surface & Coatings Technology","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0257897225009430","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, COATINGS & FILMS","Score":null,"Total":0}
Highly conductive and thick a-C:H:N films deposited at elevated temperatures via direct current PACVD
DLC films exhibit high hardness, low friction coefficient and chemical inertness but generally lack sufficient electrical conductivity. To achieve conductive films with substantial thickness, the combination of direct current plasma assisted chemical vapour deposition (DC PACVD) with high coating temperatures has proven to be effective. Nitrogen doping of DLC films, a common method for improving their electrical conduction properties, typically leads to enhanced graphitization and a reduction in hardness and Young's modulus in harder DLC coatings. This study examines how nitrogen doping affects the mechanical and electrical properties of already unusually conductive, soft and thick (> 25 μm) a-C:H films deposited at elevated temperatures using pulsed direct current PACVD. The a-C:H:N films were grown using C2H2 at 450 °C and 550 °C with an addition of 0–63 vol.-% N2 to the gas phase and studied subsequently. Nitrogen modification of the a-C:H was highly effective at enhancing mechanical properties in conjunction with electrical conductivity. Hardness and Young's modulus increased by up to 48 % and 95 %, respectively, compared to the undoped films. Relative load bearing capacity improved by up to a factor of 3.7. Specific electrical resistance decreased by more than two orders of magnitude for films deposited at 450 °C and by a factor of four for deposition at 550 °C, approximating and even surpassing the conductivity of graphite electrodes. Conversely, film thickness and deposition rate decreased significantly due to etching effects compared to the undoped a-C:H.
期刊介绍:
Surface and Coatings Technology is an international archival journal publishing scientific papers on significant developments in surface and interface engineering to modify and improve the surface properties of materials for protection in demanding contact conditions or aggressive environments, or for enhanced functional performance. Contributions range from original scientific articles concerned with fundamental and applied aspects of research or direct applications of metallic, inorganic, organic and composite coatings, to invited reviews of current technology in specific areas. Papers submitted to this journal are expected to be in line with the following aspects in processes, and properties/performance:
A. Processes: Physical and chemical vapour deposition techniques, thermal and plasma spraying, surface modification by directed energy techniques such as ion, electron and laser beams, thermo-chemical treatment, wet chemical and electrochemical processes such as plating, sol-gel coating, anodization, plasma electrolytic oxidation, etc., but excluding painting.
B. Properties/performance: friction performance, wear resistance (e.g., abrasion, erosion, fretting, etc), corrosion and oxidation resistance, thermal protection, diffusion resistance, hydrophilicity/hydrophobicity, and properties relevant to smart materials behaviour and enhanced multifunctional performance for environmental, energy and medical applications, but excluding device aspects.