Porous pathways to chill: Unravelling the influence of metal foam characteristics on heat transfer dynamics through experimental investigation

With increasing miniaturization and rising power densities of electronic devices, robust thermal management strategies are inevitable for ensuring operational stability. In the pursuit of next-generation thermal management solutions for high-density electronics, impinging jet flow (IJF) systems integrated with metal foam (MF) have emerged as a promising technique. This study investigates the interplay between pore density (measured in pores per inch or PPI), foam thickness, and flow dynamics to identify configurations that deliver optimal thermal performance. By analyzing the coupled effects of these parameters, the work aims to enhance convective heat transfer while minimizing adverse pressure losses. The investigation utilizes several key performance metrics: the average Nusselt number (Nu__avg), Colburn j-factor, Performance Enhancement Coefficient (PEC), pumping power (PP), and dimensionless power number (Np), to comprehensively assess proficient heat transfer in conjunction with hydraulic efficiency. Results reveal that lower PPI structures and increased foam thickness significantly enhance heat transfer, as evidenced by elevated Nusselt numbers resulting from intensified flow interaction and turbulence. Conversely, substrate disc plates with lower thermal conductivity exhibit reduced cooling efficiency. An empirical correlation of the form $N{u}_{avg}=c_{1}R{e}^{c_2}$ is proposed to capture the underlying heat transfer behavior. The findings offer actionable insights into the design of compact, high-performance cooling solutions tailored for next-generation electronic systems.