{"title":"分支和二次连接对y形散热器性能的影响","authors":"Shashank Singh, Anup Malik, Harlal Singh Mali","doi":"10.1016/j.ijheatfluidflow.2025.110053","DOIUrl":null,"url":null,"abstract":"<div><div>The growing demand for compact and high-performance electronic equipment leads to high heat dissipation, which causes failure. To overcome this challenge, microchannel heat sinks (MHS) significantly increase heat transfer rates above conventional techniques by having high surface area-to-volume ratios. In this work, Y-fractal MHS devices with increased branching level and secondary connections are developed by additive manufacturing. Thermo-hydraulic characteristics of the devices are examined by both numerical and experimental approaches. Maximum enhancement of 22.6% in the average Nusselt number (<span><math><mrow><mi>N</mi><msub><mrow><mi>u</mi></mrow><mrow><mi>a</mi><mi>v</mi><mi>g</mi></mrow></msub></mrow></math></span>) is achieved with an increase in the branching level at the expense of 67% pressure drop (<span><math><mrow><mi>Δ</mi><mi>P</mi></mrow></math></span>) penalty. Adding secondary connected channels results in maximum reduction of 23.1% in <span><math><mrow><mi>N</mi><msub><mrow><mi>u</mi></mrow><mrow><mi>a</mi><mi>v</mi><mi>g</mi></mrow></msub></mrow></math></span> with an insignificant effect on <span><math><mrow><mi>Δ</mi><mi>P</mi></mrow></math></span>. Y-fractal MHS with two branches (Y-FMHS-B2) shows the best thermal performance at constant pumping power (<span><math><mrow><mi>P</mi><mi>P</mi></mrow></math></span>) between the comparison range from 0.0016 to 0.005 W.</div></div>","PeriodicalId":335,"journal":{"name":"International Journal of Heat and Fluid Flow","volume":"117 ","pages":"Article 110053"},"PeriodicalIF":2.6000,"publicationDate":"2025-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of branches and secondary connections on performance of Y-fractal heat sink\",\"authors\":\"Shashank Singh, Anup Malik, Harlal Singh Mali\",\"doi\":\"10.1016/j.ijheatfluidflow.2025.110053\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The growing demand for compact and high-performance electronic equipment leads to high heat dissipation, which causes failure. To overcome this challenge, microchannel heat sinks (MHS) significantly increase heat transfer rates above conventional techniques by having high surface area-to-volume ratios. In this work, Y-fractal MHS devices with increased branching level and secondary connections are developed by additive manufacturing. Thermo-hydraulic characteristics of the devices are examined by both numerical and experimental approaches. Maximum enhancement of 22.6% in the average Nusselt number (<span><math><mrow><mi>N</mi><msub><mrow><mi>u</mi></mrow><mrow><mi>a</mi><mi>v</mi><mi>g</mi></mrow></msub></mrow></math></span>) is achieved with an increase in the branching level at the expense of 67% pressure drop (<span><math><mrow><mi>Δ</mi><mi>P</mi></mrow></math></span>) penalty. Adding secondary connected channels results in maximum reduction of 23.1% in <span><math><mrow><mi>N</mi><msub><mrow><mi>u</mi></mrow><mrow><mi>a</mi><mi>v</mi><mi>g</mi></mrow></msub></mrow></math></span> with an insignificant effect on <span><math><mrow><mi>Δ</mi><mi>P</mi></mrow></math></span>. Y-fractal MHS with two branches (Y-FMHS-B2) shows the best thermal performance at constant pumping power (<span><math><mrow><mi>P</mi><mi>P</mi></mrow></math></span>) between the comparison range from 0.0016 to 0.005 W.</div></div>\",\"PeriodicalId\":335,\"journal\":{\"name\":\"International Journal of Heat and Fluid Flow\",\"volume\":\"117 \",\"pages\":\"Article 110053\"},\"PeriodicalIF\":2.6000,\"publicationDate\":\"2025-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Journal of Heat and Fluid Flow\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0142727X2500311X\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, MECHANICAL\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Heat and Fluid Flow","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0142727X2500311X","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
Effects of branches and secondary connections on performance of Y-fractal heat sink
The growing demand for compact and high-performance electronic equipment leads to high heat dissipation, which causes failure. To overcome this challenge, microchannel heat sinks (MHS) significantly increase heat transfer rates above conventional techniques by having high surface area-to-volume ratios. In this work, Y-fractal MHS devices with increased branching level and secondary connections are developed by additive manufacturing. Thermo-hydraulic characteristics of the devices are examined by both numerical and experimental approaches. Maximum enhancement of 22.6% in the average Nusselt number () is achieved with an increase in the branching level at the expense of 67% pressure drop () penalty. Adding secondary connected channels results in maximum reduction of 23.1% in with an insignificant effect on . Y-fractal MHS with two branches (Y-FMHS-B2) shows the best thermal performance at constant pumping power () between the comparison range from 0.0016 to 0.005 W.
期刊介绍:
The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows.
Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.