分支和二次连接对y形散热器性能的影响

IF 2.6 3区 工程技术 Q2 ENGINEERING, MECHANICAL
Shashank Singh, Anup Malik, Harlal Singh Mali
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引用次数: 0

摘要

对小型化和高性能电子设备的需求日益增长,导致高散热,从而导致故障。为了克服这一挑战,微通道散热器(MHS)通过具有较高的表面积体积比,显着提高了传统技术的传热率。本文采用增材制造技术,开发了分支水平和二次连接增加的y分形MHS器件。采用数值和实验两种方法对装置的热水力特性进行了研究。通过增加分支水平,平均努塞尔数(Nuavg)的最大增强可达到22.6%,但代价是67%的压降损失(ΔP)。添加次级连接通道导致Nuavg最大减少23.1%,对ΔP的影响不显著。在泵送功率为0.0016 ~ 0.005 W范围内,具有两个分支的y -分形MHS (Y-FMHS-B2)的热性能最佳。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of branches and secondary connections on performance of Y-fractal heat sink
The growing demand for compact and high-performance electronic equipment leads to high heat dissipation, which causes failure. To overcome this challenge, microchannel heat sinks (MHS) significantly increase heat transfer rates above conventional techniques by having high surface area-to-volume ratios. In this work, Y-fractal MHS devices with increased branching level and secondary connections are developed by additive manufacturing. Thermo-hydraulic characteristics of the devices are examined by both numerical and experimental approaches. Maximum enhancement of 22.6% in the average Nusselt number (Nuavg) is achieved with an increase in the branching level at the expense of 67% pressure drop (ΔP) penalty. Adding secondary connected channels results in maximum reduction of 23.1% in Nuavg with an insignificant effect on ΔP. Y-fractal MHS with two branches (Y-FMHS-B2) shows the best thermal performance at constant pumping power (PP) between the comparison range from 0.0016 to 0.005 W.
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来源期刊
International Journal of Heat and Fluid Flow
International Journal of Heat and Fluid Flow 工程技术-工程:机械
CiteScore
5.00
自引率
7.70%
发文量
131
审稿时长
33 days
期刊介绍: The International Journal of Heat and Fluid Flow welcomes high-quality original contributions on experimental, computational, and physical aspects of convective heat transfer and fluid dynamics relevant to engineering or the environment, including multiphase and microscale flows. Papers reporting the application of these disciplines to design and development, with emphasis on new technological fields, are also welcomed. Some of these new fields include microscale electronic and mechanical systems; medical and biological systems; and thermal and flow control in both the internal and external environment.
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