NiCu双金属酞菁功能化隔膜高性能锂硫电池的构建

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Guanlian Miao, Meixuan Du, Huan Li, Jianghui He, Minghui Zhao, Lin Li, Jingtai Zhao, Guanghui Rao
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引用次数: 0

摘要

锂硫电池因其高能量密度和低成本被认为是下一代锂离子电池的理想替代品。然而,多硫化锂(LiPSs)的穿梭效应严重影响了其电化学性能。本文设计并合成了具有强吸电子基团的二维NiCu双金属聚酞菁(NiCuTnPc)、单金属聚酞菁镍(NiTnPPc)和单金属聚酞菁铜(CuTnPPc)。利用这些材料对锂硫电池正极侧的隔膜进行改性,探讨酞菁金属中心对LiPSs催化转化的促进作用。结果表明,NiCuTnPc具有协同催化作用,可加速LiPSs的氧化还原反应。结果表明,Ni和Cu之间的相互作用可以调节材料的电子结构,提高材料的催化能力,从而有效地促进Li2S的可逆转化,进一步提高电池的倍率性能和循环寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Construction of high-performance lithium–sulfur batteries with NiCu bimetallic phthalocyanine-functionalized separators

Lithium–sulfur batteries are considered to be an ideal alternative to the next generation of lithium-ion batteries due to their high energy density and low cost. However, the shuttle effect of lithium polysulfides (LiPSs) seriously affects their electrochemical performance. In this paper, we designed and synthesized two-dimensional NiCu bimetallic polyphthalocyanine (NiCuTnPc), monometallic polyphthalocyanine nickel (NiTnPPc), and monometallic polyphthalocyanine copper (CuTnPPc) with strong electron-withdrawing groups. These materials were used to modify the separator on the cathode side of lithium–sulfur batteries to explore the effect of the phthalocyanine metal center on promoting the catalytic conversion of LiPSs. It was found that NiCuTnPc could accelerate the redox reaction of LiPSs due to its synergistic catalytic effect. The results showed that the interaction between Ni and Cu can regulate the electronic structure and improve the catalytic ability of the material, thus effectively promoting the reversible conversion of Li2S and further improving the rate performance and cycle life of the battery.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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