PolyGraphCL:多晶材料晶粒级疲劳损伤预测的多视图图对比学习框架

IF 4.3 2区 综合性期刊 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
Manpreet Kaur;Sheela Ramanna;Yuejian Chen;Qian Liu
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引用次数: 0

摘要

在晶粒尺度上准确预测多晶材料的疲劳损伤是具有挑战性的,主要是由于复杂的微观结构拓扑,各向异性变形,以及相对于大量完整晶粒而言,滑移带标记损伤事件的稀缺性导致的严重的类别不平衡。传统的机器学习(ML)方法和单视图图神经网络(gnn)通常缺乏跨尺度建模这种异质性的能力。为了弥补这一差距,我们引入了PolyGraphCL,这是一种新的多视图图对比学习(CL)框架,集成了来自三个主干的异构归纳偏差:用于局部邻域聚合的图卷积网络(GCN),用于全局关注交互的图注意网络(GAT),以及用于多尺度采样的图样本和聚合(GraphSAGE)。这些不同的结构视图来自于将不同的GNN架构应用于相同的输入图,通过可学习的注意力机制融合,实现每个节点特定视图表示的动态加权,以捕获细粒度和整体结构特征。为了进一步解决极端的标签不平衡,我们结合了跨视图CL,它在跨视图对齐内节点表示的同时排斥节点间嵌入,促进了类区分流形的形成。在包含7633个晶粒(311个损坏)、每个节点100个描述符的铁素体钢微观结构数据集上进行评估,PolyGraphCL在分层五倍交叉验证下的平均${F}1$得分为$0.8816~\pm ~0.0505$,平衡精度(BA)为$0.7788~\pm ~0.1606$,超过了传统的ML基线和单视图gnn。此外,基于gnexplainer的归因揭示了PolyGraphCL的预测主要受局部应力集中控制,拓扑子结构的影响适度,提供了基于潜在物理机制的可解释见解。总之,PolyGraphCL为在计算材料科学(MS)中推进数据驱动的疲劳预测提供了一个健壮的、可解释的和领域自适应的框架。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
PolyGraphCL: A Multiview Graph Contrastive Learning Framework for Grain-Level Fatigue Damage Prediction in Polycrystalline Materials
Accurately predicting fatigue damage at the grain scale in polycrystalline materials is challenging, primarily due to the complex microstructural topology, anisotropic deformation, and severe class imbalance caused by the rarity of slip-band-marked damage events relative to the vast population of intact grains. Conventional machine learning (ML) methods and single-view graph neural networks (GNNs) often lack the capacity to model such heterogeneity across scales. To bridge this gap, we introduce PolyGraphCL, a novel multiview graph contrastive learning (CL) framework integrating heterogeneous inductive biases from three backbones—graph convolutional network (GCN) for localized neighborhood aggregation, graph attention network (GAT) for globally attentive interactions, and graph sample and aggregate (GraphSAGE) for multiscale sampling. These diverse structural views, derived from applying different GNN architectures to the same input graph, are fused through a learnable attention mechanism, enabling dynamic weighting of view-specific representations per node to capture both fine-grained and holistic structural characteristics. To further address extreme label imbalance, we incorporate cross-view CL that aligns intranode representations across views while repelling internode embeddings, facilitating the formation of class-discriminative manifolds. Evaluated on a ferritic steel microstructure dataset comprising 7633 grains (311 damaged) with 100 descriptors per node, PolyGraphCL achieves an average ${F}1$ score of $0.8816~\pm ~0.0505$ and balanced accuracy (BA) of $0.7788~\pm ~0.1606$ under stratified fivefold cross-validation-surpassing both conventional ML baselines and single-view GNNs. Furthermore, GNNExplainer-based attribution reveals that PolyGraphCL’s predictions are predominantly governed by local stress concentration, with moderate influence from topological substructures, offering interpretable insights grounded in underlying physical mechanisms. Altogether, PolyGraphCL offers a robust, interpretable, and domain-adaptive framework for advancing data-driven fatigue prediction in computational materials science (MS).
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来源期刊
IEEE Sensors Journal
IEEE Sensors Journal 工程技术-工程:电子与电气
CiteScore
7.70
自引率
14.00%
发文量
2058
审稿时长
5.2 months
期刊介绍: The fields of interest of the IEEE Sensors Journal are the theory, design , fabrication, manufacturing and applications of devices for sensing and transducing physical, chemical and biological phenomena, with emphasis on the electronics and physics aspect of sensors and integrated sensors-actuators. IEEE Sensors Journal deals with the following: -Sensor Phenomenology, Modelling, and Evaluation -Sensor Materials, Processing, and Fabrication -Chemical and Gas Sensors -Microfluidics and Biosensors -Optical Sensors -Physical Sensors: Temperature, Mechanical, Magnetic, and others -Acoustic and Ultrasonic Sensors -Sensor Packaging -Sensor Networks -Sensor Applications -Sensor Systems: Signals, Processing, and Interfaces -Actuators and Sensor Power Systems -Sensor Signal Processing for high precision and stability (amplification, filtering, linearization, modulation/demodulation) and under harsh conditions (EMC, radiation, humidity, temperature); energy consumption/harvesting -Sensor Data Processing (soft computing with sensor data, e.g., pattern recognition, machine learning, evolutionary computation; sensor data fusion, processing of wave e.g., electromagnetic and acoustic; and non-wave, e.g., chemical, gravity, particle, thermal, radiative and non-radiative sensor data, detection, estimation and classification based on sensor data) -Sensors in Industrial Practice
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