From planar to stacked: a comparative analysis of 2D and 3D ICs from the perspective of architecture, performance, and fabrication

This paper compares the performance, architecture, and challenges of two-dimensional (2D) and three-dimensional (3D) integrated circuits (ICs). As the semiconductor industry aims for enhanced performance, a noticeable shift has occurred from 2D to 3D designs. This study is based on a comprehensive review of approximately 33 papers published between 2000 and 2024. The extensive literature base enriches our research’s depth and nuance, Making it well-informed and impactful. Relying on simulations and experimental data, key issues such as heat Management, component density, and power efficiency are examined. It addresses essential factors, including processing speed, power consumption, heat management, and scalability, while analyzing the advantages and disadvantages of each design. The paper also investigates the challenges of manufacturing, reliability, costs, signal quality, and the ability of current design tools to meet the demands of these technologies. While 2D ICs are more straightforward and less expensive, 3D ICs offer significant advantages. They can accommodate more components in less space, operate at higher speeds, and consume less power due to the stacking of layers and reduced connection distances. This research enhances our understanding of future trends in IC technology. It could guide the semiconductor industry in addressing the growing demand for faster, more powerful, and more energy-efficient devices.