Quashigah Johnray Ziadzi, Haihua Wu, Michael Gyan, Esther Dzigbogi, Bin Chao, Shixiong Deng
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Review of the fabrication methods of microwave absorbers via selective laser sintering and fused deposition modeling
Microwave absorbers play a vital role in applications such as electromagnetic interference shielding, stealth technology, and radar systems by minimizing signal reflection and transmission. This review explores the fabrication of microwave absorbers using two additive manufacturing techniques, Selective Laser Sintering (SLS) and Fused Deposition Modeling (FDM). SLS, a powder-based method, allows precise control over material composition and microstructure, enabling the production of absorbers with tailored electromagnetic properties. Recent studies highlight its effectiveness in creating composite materials with enhanced absorption capabilities. FDM, known for its cost-effectiveness and versatility, has been used to develop absorbers incorporating conductive fillers within thermoplastic matrices. Innovations in structural design, such as biomimetic approaches, have further improved performance. This review compares the advantages of SLS and FDM, focusing on material selection, structural design, and post-processing techniques to optimize absorption performance. The findings underscore the potential of additive manufacturing to advance microwave absorber technology for industrial and defense applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.