高容量电解电容器用铝箔的3-巯基丙基三乙氧基硅烷模板蚀刻

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Guizhong Feng, Hongzhu Huang, Qisen Wang, Zhe Zhang, Ning Peng
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引用次数: 0

摘要

铝电解电容器因其高容量电容和高性价比而广泛应用于电子领域。然而,在传统的铝箔蚀刻工艺中,隧道形成不均匀和隧道合并过多往往限制了它们的性能。本研究引入3-巯基丙基三乙氧基硅烷(MPTES)作为模板剂来控制铝箔蚀刻隧道的成核和生长。多孔MPTES自组装膜有效地引导均匀隧道的形成,显著提高了隧道的分布均匀性和尺寸一致性。该优化提高了箔的比表面积,在最佳条件下(1% MPTES, 5分钟处理),比电容增加了8.3%。我们的发现为改进高性能铝电解电容器的蚀刻工艺提供了一种实用且可扩展的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
3-mercaptopropyltriethoxysilane templated etching of aluminum foil for high-capacitance electrolytic capacitors

Aluminum electrolytic capacitors are widely used in electronics due to their high volumetric capacitance and cost-effectiveness. However, their performance is often Limited by non-uniform tunnel formation and excessive tunnel merging during conventional aluminum foil etching processes. In this study, we introduce 3-mercaptopropyltriethoxysilane (MPTES) as a templating agent to control the nucleation and growth of etched tunnels in aluminum foil. The porous MPTES self-assembled film effectively guides the formation of uniform tunnels, significantly improving their distribution homogeneity and dimensional consistency. This optimization enhances the foil’s specific surface area, yielding an 8.3% increase in specific capacitance under optimal conditions (1% MPTES, 5 min treatment). Our findings provide a practical and scalable approach to improve etching processes for high-performance aluminum electrolytic capacitors.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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