w波段相控阵收发器的低损耗可扩展扇出晶圆级封装

IF 4.5 1区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Ding Wang;Hong Bin Hu;Qi Peng;Chen Hui Xia;Yu Hang Yin;Ning Yang;Xiao Lin Qi;Yong Fan;Yu Jian Cheng
{"title":"w波段相控阵收发器的低损耗可扩展扇出晶圆级封装","authors":"Ding Wang;Hong Bin Hu;Qi Peng;Chen Hui Xia;Yu Hang Yin;Ning Yang;Xiao Lin Qi;Yong Fan;Yu Jian Cheng","doi":"10.1109/TMTT.2025.3571627","DOIUrl":null,"url":null,"abstract":"This article introduces a low-cost compact W-band <inline-formula> <tex-math>$4\\times 4$ </tex-math></inline-formula> phased array antenna utilizing fan-out wafer-level package (FOWLP) for high-performance applications. The package, measuring <inline-formula> <tex-math>$8.3\\times 7.1$ </tex-math></inline-formula> mm, integrates a 16-channel transceiver die. To minimize the insertion loss and enhance impedance matching across the W band, the design incorporates an air-filled grounded coplanar waveguide (AF-GCPW) transmission line. An innovative thermal management strategy, which includes ball grid arrays (BGAs) and embedded copper slugs in the PCB, ensures efficient heat dissipation. Experimental results reveal that the array can achieve scanning capabilities of ±40° in the <italic>H</i>-plane and ±30° in the <italic>E</i>-plane, with an effective isotropic radiated power (EIRP) of 35 dBm at 94 GHz. The proposed phased array demonstrates superior performance compared to existing designs by reducing packaging loss, minimizing the number of metal layers, and enhancing cost-effectiveness. Consequently, it emerges as a promising solution for radar and sensing applications.","PeriodicalId":13272,"journal":{"name":"IEEE Transactions on Microwave Theory and Techniques","volume":"73 9","pages":"5966-5978"},"PeriodicalIF":4.5000,"publicationDate":"2025-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Low-Loss Scalable Fan-Out Wafer Level Packaging for W-Band Phased Array Transceiver\",\"authors\":\"Ding Wang;Hong Bin Hu;Qi Peng;Chen Hui Xia;Yu Hang Yin;Ning Yang;Xiao Lin Qi;Yong Fan;Yu Jian Cheng\",\"doi\":\"10.1109/TMTT.2025.3571627\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article introduces a low-cost compact W-band <inline-formula> <tex-math>$4\\\\times 4$ </tex-math></inline-formula> phased array antenna utilizing fan-out wafer-level package (FOWLP) for high-performance applications. The package, measuring <inline-formula> <tex-math>$8.3\\\\times 7.1$ </tex-math></inline-formula> mm, integrates a 16-channel transceiver die. To minimize the insertion loss and enhance impedance matching across the W band, the design incorporates an air-filled grounded coplanar waveguide (AF-GCPW) transmission line. An innovative thermal management strategy, which includes ball grid arrays (BGAs) and embedded copper slugs in the PCB, ensures efficient heat dissipation. Experimental results reveal that the array can achieve scanning capabilities of ±40° in the <italic>H</i>-plane and ±30° in the <italic>E</i>-plane, with an effective isotropic radiated power (EIRP) of 35 dBm at 94 GHz. The proposed phased array demonstrates superior performance compared to existing designs by reducing packaging loss, minimizing the number of metal layers, and enhancing cost-effectiveness. Consequently, it emerges as a promising solution for radar and sensing applications.\",\"PeriodicalId\":13272,\"journal\":{\"name\":\"IEEE Transactions on Microwave Theory and Techniques\",\"volume\":\"73 9\",\"pages\":\"5966-5978\"},\"PeriodicalIF\":4.5000,\"publicationDate\":\"2025-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Microwave Theory and Techniques\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11021223/\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Microwave Theory and Techniques","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11021223/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

本文介绍了一种采用扇出晶圆级封装(FOWLP)的低成本紧凑型w波段4 × 4美元相控阵天线,用于高性能应用。该封装尺寸为8.3 × 7.1 mm,集成了一个16通道收发器芯片。为了最大限度地减少插入损耗并增强整个W波段的阻抗匹配,该设计采用了充气接地共面波导(AF-GCPW)传输线。创新的热管理策略,包括球栅阵列(BGAs)和PCB中的嵌入式铜段塞,确保了高效的散热。实验结果表明,该阵列可实现h面±40°和e面±30°的扫描能力,在94 GHz时有效各向同性辐射功率(EIRP)为35 dBm。与现有设计相比,所提出的相控阵通过减少封装损耗、减少金属层数量和提高成本效益,展示了卓越的性能。因此,它成为雷达和传感应用的一个有前途的解决方案。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Low-Loss Scalable Fan-Out Wafer Level Packaging for W-Band Phased Array Transceiver
This article introduces a low-cost compact W-band $4\times 4$ phased array antenna utilizing fan-out wafer-level package (FOWLP) for high-performance applications. The package, measuring $8.3\times 7.1$ mm, integrates a 16-channel transceiver die. To minimize the insertion loss and enhance impedance matching across the W band, the design incorporates an air-filled grounded coplanar waveguide (AF-GCPW) transmission line. An innovative thermal management strategy, which includes ball grid arrays (BGAs) and embedded copper slugs in the PCB, ensures efficient heat dissipation. Experimental results reveal that the array can achieve scanning capabilities of ±40° in the H-plane and ±30° in the E-plane, with an effective isotropic radiated power (EIRP) of 35 dBm at 94 GHz. The proposed phased array demonstrates superior performance compared to existing designs by reducing packaging loss, minimizing the number of metal layers, and enhancing cost-effectiveness. Consequently, it emerges as a promising solution for radar and sensing applications.
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来源期刊
IEEE Transactions on Microwave Theory and Techniques
IEEE Transactions on Microwave Theory and Techniques 工程技术-工程:电子与电气
CiteScore
8.60
自引率
18.60%
发文量
486
审稿时长
6 months
期刊介绍: The IEEE Transactions on Microwave Theory and Techniques focuses on that part of engineering and theory associated with microwave/millimeter-wave components, devices, circuits, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, and industrial, activities. Microwave theory and techniques relates to electromagnetic waves usually in the frequency region between a few MHz and a THz; other spectral regions and wave types are included within the scope of the Society whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.
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