{"title":"超导基板通孔(TSSV)的论证及其在横向交叉耦合高温超导滤波器设计中的应用","authors":"Xilong Lu;Qingyu Kong;Guangsong Wei;Shigang Zhou;Liguo Zhou;Pengyu Ma;Qingyue Liu;Rui Zhang","doi":"10.1109/TMTT.2025.3557413","DOIUrl":null,"url":null,"abstract":"This article proposes and verifies the through superconducting substrate via (TSSV) technology for high-temperature superconducting (HTS) filters for the first time, which can be used to achieve vertical interconnection of superconducting substrates (YBCO/magnesium oxide (MgO)], advancing the design and manufacturing of HTS filters from 2-D plane to 3-D integration. The vertical interconnection between the top and bottom layers of the superconducting coplanar waveguide (CPW) lines is realized using TSSV. A dual-mode resonator based on TSSV is constructed, and the characteristic plane method (CPM) is proposed to uniquely distinguish multiple odd- and even-mode frequencies. A systematic study of the transverse cross-coupling structure is presented, through formula derivation, the influence of cross-coupling is separated from the total coupling, allowing for a clear analysis of its impact on the filter response. To validate the proposed methods, two- and four-stage transversal cross-coupling HTS filters are designed using TSSV. The measured results show excellent agreement with the design specifications.","PeriodicalId":13272,"journal":{"name":"IEEE Transactions on Microwave Theory and Techniques","volume":"73 9","pages":"6654-6667"},"PeriodicalIF":4.5000,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Demonstration of Through Superconducting Substrate Via (TSSV) and Its Application to Transversal Cross-Coupling HTS Filter Design\",\"authors\":\"Xilong Lu;Qingyu Kong;Guangsong Wei;Shigang Zhou;Liguo Zhou;Pengyu Ma;Qingyue Liu;Rui Zhang\",\"doi\":\"10.1109/TMTT.2025.3557413\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This article proposes and verifies the through superconducting substrate via (TSSV) technology for high-temperature superconducting (HTS) filters for the first time, which can be used to achieve vertical interconnection of superconducting substrates (YBCO/magnesium oxide (MgO)], advancing the design and manufacturing of HTS filters from 2-D plane to 3-D integration. The vertical interconnection between the top and bottom layers of the superconducting coplanar waveguide (CPW) lines is realized using TSSV. A dual-mode resonator based on TSSV is constructed, and the characteristic plane method (CPM) is proposed to uniquely distinguish multiple odd- and even-mode frequencies. A systematic study of the transverse cross-coupling structure is presented, through formula derivation, the influence of cross-coupling is separated from the total coupling, allowing for a clear analysis of its impact on the filter response. To validate the proposed methods, two- and four-stage transversal cross-coupling HTS filters are designed using TSSV. The measured results show excellent agreement with the design specifications.\",\"PeriodicalId\":13272,\"journal\":{\"name\":\"IEEE Transactions on Microwave Theory and Techniques\",\"volume\":\"73 9\",\"pages\":\"6654-6667\"},\"PeriodicalIF\":4.5000,\"publicationDate\":\"2025-04-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Microwave Theory and Techniques\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/10979522/\",\"RegionNum\":1,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Microwave Theory and Techniques","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10979522/","RegionNum":1,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
The Demonstration of Through Superconducting Substrate Via (TSSV) and Its Application to Transversal Cross-Coupling HTS Filter Design
This article proposes and verifies the through superconducting substrate via (TSSV) technology for high-temperature superconducting (HTS) filters for the first time, which can be used to achieve vertical interconnection of superconducting substrates (YBCO/magnesium oxide (MgO)], advancing the design and manufacturing of HTS filters from 2-D plane to 3-D integration. The vertical interconnection between the top and bottom layers of the superconducting coplanar waveguide (CPW) lines is realized using TSSV. A dual-mode resonator based on TSSV is constructed, and the characteristic plane method (CPM) is proposed to uniquely distinguish multiple odd- and even-mode frequencies. A systematic study of the transverse cross-coupling structure is presented, through formula derivation, the influence of cross-coupling is separated from the total coupling, allowing for a clear analysis of its impact on the filter response. To validate the proposed methods, two- and four-stage transversal cross-coupling HTS filters are designed using TSSV. The measured results show excellent agreement with the design specifications.
期刊介绍:
The IEEE Transactions on Microwave Theory and Techniques focuses on that part of engineering and theory associated with microwave/millimeter-wave components, devices, circuits, and systems involving the generation, modulation, demodulation, control, transmission, and detection of microwave signals. This includes scientific, technical, and industrial, activities. Microwave theory and techniques relates to electromagnetic waves usually in the frequency region between a few MHz and a THz; other spectral regions and wave types are included within the scope of the Society whenever basic microwave theory and techniques can yield useful results. Generally, this occurs in the theory of wave propagation in structures with dimensions comparable to a wavelength, and in the related techniques for analysis and design.