二酮吡咯吡咯半导体聚合物薄膜的断裂行为

IF 7 2区 材料科学 Q2 CHEMISTRY, PHYSICAL
Song Zhang, , , Yunfei Wang, , , Gage T. Mason, , , Zhiyuan Qian, , , Simon Rondeau-Gagné, , and , Xiaodan Gu*, 
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引用次数: 0

摘要

断裂能量化了材料对已有裂纹扩展的阻力,是确保可拉伸有机电子器件机械可靠性的关键参数。然而,大多数现有的方法,如四点弯曲断裂能,用于测量半导体聚合物薄膜的断裂能,由于衬底效应而变得复杂,因此很难将薄膜的内在行为与界面影响分离开来。在本研究中,我们采用伪独立纯剪切方法系统地研究了聚二酮吡咯-噻吩(DPP-T)基薄膜的内聚断裂能,考察了纳米约束、侧链长度、结晶度和应变速率对薄膜内聚断裂能的影响。该方法有效地消除了衬底干扰,能够直接评估P(DPP-T)薄膜的内聚断裂能。我们发现,由于链缠结减少,较薄的薄膜和分子量较低的薄膜表现出明显降低的断裂能。此外,侧链较短的薄膜显示出明显更高的断裂能,这是由于结晶度的增加。最后,较慢的应变速率导致较高的断裂能,与增强的应力松弛一致。这些见解为设计机械坚固的半导体聚合物提供了实用指南,有助于开发可靠、耐用、灵活和可穿戴的电子设备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Thin-Film Fracture Behavior for Diketopyrrolopyrrole Semiconducting Polymeric Films

Thin-Film Fracture Behavior for Diketopyrrolopyrrole Semiconducting Polymeric Films

Fracture energy, which quantifies a material’s resistance to the propagation of a pre-existing crack, is a key parameter for ensuring the mechanical reliability of stretchable organic electronic devices. However, most existing methods, such as a four-point bending fracture energy, utilized for measuring the fracture energy of semiconducting polymeric thin films are complicated by substrate effects, making it challenging to isolate the intrinsic behavior of the film from interfacial influences. In this study, we employed a pseudo free-standing pure shear method to systematically investigate the cohesive fracture energy of poly(diketopyrrolopyrrole-terthiophene) P(DPP-T)-based thin films to examine the effects of nanoconfinement, side chain length, degree of crystallinity, and strain rates. This method effectively eliminates substrate interference, enabling a direct assessment of the cohesive fracture energy of P(DPP-T) thin films. We found that thinner films and those with lower molecular weights exhibited significantly reduced fracture energies due to diminished chain entanglements. Additionally, films with shorter side chains displayed notably higher fracture energies, which were attributed to an increase in the degree of crystallinity. Finally, slower strain rates led to higher fracture energies, consistent with an enhanced stress relaxation. These insights offer practical guidelines for designing mechanically robust semiconducting polymers, contributing to the advancement of reliable, durable, flexible, and wearable electronic devices.

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来源期刊
Chemistry of Materials
Chemistry of Materials 工程技术-材料科学:综合
CiteScore
14.10
自引率
5.80%
发文量
929
审稿时长
1.5 months
期刊介绍: The journal Chemistry of Materials focuses on publishing original research at the intersection of materials science and chemistry. The studies published in the journal involve chemistry as a prominent component and explore topics such as the design, synthesis, characterization, processing, understanding, and application of functional or potentially functional materials. The journal covers various areas of interest, including inorganic and organic solid-state chemistry, nanomaterials, biomaterials, thin films and polymers, and composite/hybrid materials. The journal particularly seeks papers that highlight the creation or development of innovative materials with novel optical, electrical, magnetic, catalytic, or mechanical properties. It is essential that manuscripts on these topics have a primary focus on the chemistry of materials and represent a significant advancement compared to prior research. Before external reviews are sought, submitted manuscripts undergo a review process by a minimum of two editors to ensure their appropriateness for the journal and the presence of sufficient evidence of a significant advance that will be of broad interest to the materials chemistry community.
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