光致电沉积制备疏水表面铜微柱及其表征

IF 5.6 3区材料科学 Q1 ELECTROCHEMISTRY

Electrochimica Acta Pub Date : 2025-09-16 DOI:10.1016/j.electacta.2025.147402

Zibo Di, Chenghan Zhao, Wenzheng Wu

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引用次数: 0

摘要

开发了一种光致电沉积系统，用于研究铜微柱的制备。系统地研究了电极间隙和氢化非晶硅（a-Si:H）厚度的影响。结果表明，电极间隙对矿柱形貌、沉积速率和直径有较大影响。截面分析证实，适当的间隙可导致致密而均匀的微观结构。a- si:H层的厚度也起着关键作用：层厚可以提高沉积效率，改善结构均匀性，增加表面疏水性。利用这种方法，成功制备了具有微/纳米结构和强疏水性的铜表面，为微尺度应用中的功能表面设计提供了一种潜在的策略。

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Fabrication and Characterization of Copper Micropillars with Hydrophobic Surfaces via Light-Induced Electrodeposition

A light-induced electrodeposition system was developed to study the fabrication of copper micropillars. The effects of electrode gap and hydrogenated amorphous silicon (a-Si:H) thickness were systematically investigated. The results show that the electrode gap strongly influences pillar morphology, deposition rate, and diameter. An appropriate gap leads to dense and uniform microstructures, as confirmed by cross-sectional analysis. The thickness of the a-Si:H layer also plays a key role: thicker layers enhance deposition efficiency, improve structural uniformity, and increase surface hydrophobicity. Using this approach, copper surfaces with micro/nanostructures and strong hydrophobic properties were successfully fabricated, providing a potential strategy for functional surface design in microscale applications.

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来源期刊

Electrochimica Acta 工程技术-电化学

CiteScore

11.30

自引率

6.10%

发文量

1634

审稿时长

41 days

期刊介绍： Electrochimica Acta is an international journal. It is intended for the publication of both original work and reviews in the field of electrochemistry. Electrochemistry should be interpreted to mean any of the research fields covered by the Divisions of the International Society of Electrochemistry listed below, as well as emerging scientific domains covered by ISE New Topics Committee.