可扩展嵌入式有源桥芯片组支持小型化和高性价比的可编程2.5D/3.5D平台

IF 3.8 2区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

IEEE Journal on Emerging and Selected Topics in Circuits and Systems Pub Date : 2025-07-30 DOI:10.1109/JETCAS.2025.3594169

Wei Lu;Jie Zhang;Yi-Hui Wei;Hsu-Ming Hsiao;Sih-Han Li;Chao-Kai Hsu;Chih-Cheng Hsiao;Feng-Hsiang Lo;Shyh-Shyuan Sheu;Chin-Hung Wang;Ching-Iang Li;Yung-Sheng Chang;Ming-Ji Dai;Wei-Chung Lo;Shih-Chieh Chang;Hung-Ming Chen;Kuan-Neng Chen;Po-Tsang Huang

{"title":"可扩展嵌入式有源桥芯片组支持小型化和高性价比的可编程2.5D/3.5D平台","authors":"Wei Lu;Jie Zhang;Yi-Hui Wei;Hsu-Ming Hsiao;Sih-Han Li;Chao-Kai Hsu;Chih-Cheng Hsiao;Feng-Hsiang Lo;Shyh-Shyuan Sheu;Chin-Hung Wang;Ching-Iang Li;Yung-Sheng Chang;Ming-Ji Dai;Wei-Chung Lo;Shih-Chieh Chang;Hung-Ming Chen;Kuan-Neng Chen;Po-Tsang Huang","doi":"10.1109/JETCAS.2025.3594169","DOIUrl":null,"url":null,"abstract":"This paper presents the Embedded Multi-die Active Bridge (EMAB) chip, a programmable bridge for cost-effective 2.5D/3.5D packaging technologies. The EMAB chip features a reconfigurable switch array to establish flexible I/O links for connecting multiple chiplets, forming an EMAB chipset based on user needs. It integrates low-dropout regulators (LDOs) for in-package voltage regulation and supports various transmission interfaces, including checkerboard I/Os (50 Mbps–1 Gbps) and MUX I/Os (up to 8 Gbps). Moreover, multiple EMAB chips can be interconnected in a daisy-chain configuration, enabling easy expansion of the EMAB chipset. Additionally, the EMAB chip eliminates TSVs in silicon interposer-based 2.5D packaging technologies and reduces redistribution layer (RDL) complexity through flexible I/O links established within the EMAB chip. Furthermore, EMAB chip can be pre-manufactured as a precast supporting layer (known good die, KGD), which shortens the product development cycle and enhance integration yield. Overall, the EMAB chip offers a miniaturized, low-cost, fast time-to-market and scalable solution for advanced 2.5D/3.5D packaging.","PeriodicalId":48827,"journal":{"name":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","volume":"15 3","pages":"379-391"},"PeriodicalIF":3.8000,"publicationDate":"2025-07-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset\",\"authors\":\"Wei Lu;Jie Zhang;Yi-Hui Wei;Hsu-Ming Hsiao;Sih-Han Li;Chao-Kai Hsu;Chih-Cheng Hsiao;Feng-Hsiang Lo;Shyh-Shyuan Sheu;Chin-Hung Wang;Ching-Iang Li;Yung-Sheng Chang;Ming-Ji Dai;Wei-Chung Lo;Shih-Chieh Chang;Hung-Ming Chen;Kuan-Neng Chen;Po-Tsang Huang\",\"doi\":\"10.1109/JETCAS.2025.3594169\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents the Embedded Multi-die Active Bridge (EMAB) chip, a programmable bridge for cost-effective 2.5D/3.5D packaging technologies. The EMAB chip features a reconfigurable switch array to establish flexible I/O links for connecting multiple chiplets, forming an EMAB chipset based on user needs. It integrates low-dropout regulators (LDOs) for in-package voltage regulation and supports various transmission interfaces, including checkerboard I/Os (50 Mbps–1 Gbps) and MUX I/Os (up to 8 Gbps). Moreover, multiple EMAB chips can be interconnected in a daisy-chain configuration, enabling easy expansion of the EMAB chipset. Additionally, the EMAB chip eliminates TSVs in silicon interposer-based 2.5D packaging technologies and reduces redistribution layer (RDL) complexity through flexible I/O links established within the EMAB chip. Furthermore, EMAB chip can be pre-manufactured as a precast supporting layer (known good die, KGD), which shortens the product development cycle and enhance integration yield. Overall, the EMAB chip offers a miniaturized, low-cost, fast time-to-market and scalable solution for advanced 2.5D/3.5D packaging.\",\"PeriodicalId\":48827,\"journal\":{\"name\":\"IEEE Journal on Emerging and Selected Topics in Circuits and Systems\",\"volume\":\"15 3\",\"pages\":\"379-391\"},\"PeriodicalIF\":3.8000,\"publicationDate\":\"2025-07-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Journal on Emerging and Selected Topics in Circuits and Systems\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11104218/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Journal on Emerging and Selected Topics in Circuits and Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11104218/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}

引用次数: 0

摘要

本文介绍了嵌入式多模有源桥接（EMAB）芯片，这是一种可编程桥接，用于经济高效的2.5D/3.5D封装技术。EMAB芯片采用可重新配置的开关阵列，建立灵活的I/O链路，用于连接多个小芯片，根据用户需求组成EMAB芯片组。它集成了用于封装内电压调节的低差稳压器（ldo），并支持各种传输接口，包括棋盘I/ o （50 Mbps-1 Gbps）和MUX I/ o（高达8 Gbps）。此外，多个EMAB芯片可以在菊花链配置中互连，使EMAB芯片组易于扩展。此外，EMAB芯片消除了基于硅介层的2.5D封装技术中的tsv，并通过在EMAB芯片内建立灵活的I/O链路降低了再分配层（RDL）的复杂性。此外，EMAB芯片可以作为预制支撑层（称为good die， KGD）进行预制造，缩短了产品开发周期，提高了成品率。总体而言，EMAB芯片为先进的2.5D/3.5D封装提供了小型化、低成本、快速上市和可扩展的解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset

This paper presents the Embedded Multi-die Active Bridge (EMAB) chip, a programmable bridge for cost-effective 2.5D/3.5D packaging technologies. The EMAB chip features a reconfigurable switch array to establish flexible I/O links for connecting multiple chiplets, forming an EMAB chipset based on user needs. It integrates low-dropout regulators (LDOs) for in-package voltage regulation and supports various transmission interfaces, including checkerboard I/Os (50 Mbps–1 Gbps) and MUX I/Os (up to 8 Gbps). Moreover, multiple EMAB chips can be interconnected in a daisy-chain configuration, enabling easy expansion of the EMAB chipset. Additionally, the EMAB chip eliminates TSVs in silicon interposer-based 2.5D packaging technologies and reduces redistribution layer (RDL) complexity through flexible I/O links established within the EMAB chip. Furthermore, EMAB chip can be pre-manufactured as a precast supporting layer (known good die, KGD), which shortens the product development cycle and enhance integration yield. Overall, the EMAB chip offers a miniaturized, low-cost, fast time-to-market and scalable solution for advanced 2.5D/3.5D packaging.

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来源期刊

IEEE Journal on Emerging and Selected Topics in Circuits and Systems ENGINEERING, ELECTRICAL & ELECTRONIC-

CiteScore

8.50

自引率

2.20%

发文量

期刊介绍： The IEEE Journal on Emerging and Selected Topics in Circuits and Systems is published quarterly and solicits, with particular emphasis on emerging areas, special issues on topics that cover the entire scope of the IEEE Circuits and Systems (CAS) Society, namely the theory, analysis, design, tools, and implementation of circuits and systems, spanning their theoretical foundations, applications, and architectures for signal and information processing.