Sajid Hussain , Hassan Elahi , Hamid Jabbar , Amir Hamza , Umar Shahbaz Khan , Muhammad Mubasher Saleem
{"title":"一种集成电容传感的电热驱动高放大MEMS微夹持器","authors":"Sajid Hussain , Hassan Elahi , Hamid Jabbar , Amir Hamza , Umar Shahbaz Khan , Muhammad Mubasher Saleem","doi":"10.1016/j.sna.2025.117038","DOIUrl":null,"url":null,"abstract":"<div><div>The significant challenges in the development of Microelectromechanical Systems (MEMS) microgrippers are scalability, power efficiency and seamless integration. In this research paper, a MEMS microgripper is presented, which uses electrothermal actuation and capacitive sensing to address these challenges. A two–stage displacement amplification is incorporated to achieve a high amplification ratio of 14.2. The novel design effectively overcomes the challenge of achieving high jaw displacement for a low input voltage, enabling seamless integration of the device into practical applications. For the optimization of the design of microgripper, Finite Element Method (FEM) is carried out using COMSOL Multiphysics. The simulation results are employed to determine the maximum allowable actuation voltage of 12 V, for which the microgripper stays within its temperature and fracture limits. Furthermore, experimental validation of the microgripper’s performance is carried out using microprobes and a microscope equipped with a camera system. The experimental results indicate a maximum jaw displacement of 51.32 µm for the maximum actuation voltage of 12 V. Additionally, the capacitive sensor is calibrated for displacement measurement, offering a resolution of 0.041 pF/µm. An analytical gripping force model is developed to estimate the gripping force at the jaws. The microgripper can generate a maximum gripping force of 0.72 µN. The microgripper has successfully performed a microwire gripping task to demonstrate its versatility in micromanipulation and biomedical applications.</div></div>","PeriodicalId":21689,"journal":{"name":"Sensors and Actuators A-physical","volume":"395 ","pages":"Article 117038"},"PeriodicalIF":4.9000,"publicationDate":"2025-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An electrothermally actuated high amplification MEMS microgripper with integrated capacitive sensing for micromanipulation\",\"authors\":\"Sajid Hussain , Hassan Elahi , Hamid Jabbar , Amir Hamza , Umar Shahbaz Khan , Muhammad Mubasher Saleem\",\"doi\":\"10.1016/j.sna.2025.117038\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>The significant challenges in the development of Microelectromechanical Systems (MEMS) microgrippers are scalability, power efficiency and seamless integration. In this research paper, a MEMS microgripper is presented, which uses electrothermal actuation and capacitive sensing to address these challenges. A two–stage displacement amplification is incorporated to achieve a high amplification ratio of 14.2. The novel design effectively overcomes the challenge of achieving high jaw displacement for a low input voltage, enabling seamless integration of the device into practical applications. For the optimization of the design of microgripper, Finite Element Method (FEM) is carried out using COMSOL Multiphysics. The simulation results are employed to determine the maximum allowable actuation voltage of 12 V, for which the microgripper stays within its temperature and fracture limits. Furthermore, experimental validation of the microgripper’s performance is carried out using microprobes and a microscope equipped with a camera system. The experimental results indicate a maximum jaw displacement of 51.32 µm for the maximum actuation voltage of 12 V. Additionally, the capacitive sensor is calibrated for displacement measurement, offering a resolution of 0.041 pF/µm. An analytical gripping force model is developed to estimate the gripping force at the jaws. The microgripper can generate a maximum gripping force of 0.72 µN. The microgripper has successfully performed a microwire gripping task to demonstrate its versatility in micromanipulation and biomedical applications.</div></div>\",\"PeriodicalId\":21689,\"journal\":{\"name\":\"Sensors and Actuators A-physical\",\"volume\":\"395 \",\"pages\":\"Article 117038\"},\"PeriodicalIF\":4.9000,\"publicationDate\":\"2025-09-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Sensors and Actuators A-physical\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S0924424725008441\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Sensors and Actuators A-physical","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0924424725008441","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
An electrothermally actuated high amplification MEMS microgripper with integrated capacitive sensing for micromanipulation
The significant challenges in the development of Microelectromechanical Systems (MEMS) microgrippers are scalability, power efficiency and seamless integration. In this research paper, a MEMS microgripper is presented, which uses electrothermal actuation and capacitive sensing to address these challenges. A two–stage displacement amplification is incorporated to achieve a high amplification ratio of 14.2. The novel design effectively overcomes the challenge of achieving high jaw displacement for a low input voltage, enabling seamless integration of the device into practical applications. For the optimization of the design of microgripper, Finite Element Method (FEM) is carried out using COMSOL Multiphysics. The simulation results are employed to determine the maximum allowable actuation voltage of 12 V, for which the microgripper stays within its temperature and fracture limits. Furthermore, experimental validation of the microgripper’s performance is carried out using microprobes and a microscope equipped with a camera system. The experimental results indicate a maximum jaw displacement of 51.32 µm for the maximum actuation voltage of 12 V. Additionally, the capacitive sensor is calibrated for displacement measurement, offering a resolution of 0.041 pF/µm. An analytical gripping force model is developed to estimate the gripping force at the jaws. The microgripper can generate a maximum gripping force of 0.72 µN. The microgripper has successfully performed a microwire gripping task to demonstrate its versatility in micromanipulation and biomedical applications.
期刊介绍:
Sensors and Actuators A: Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:
• Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.
• Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.
• Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.
• Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.
Etc...