基于双动态网络的高强度可脱粘光固化胶

IF 7.4 2区 化学 Q1 POLYMER SCIENCE
Kunpeng Zheng, Juntao Wang, Junyi Chen, Jingye Hao, Zetong Liu, Suli Xing, Jinshui Yang, Dingding Chen
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引用次数: 0

摘要

精密设备在制造过程中的临时固定需要高效、可控脱粘的胶粘剂,而现有热固性胶粘剂由于不可逆共价交联在按需脱粘方面面临挑战。为了解决这一难题,开发了一种结合氢键和二硫键双动态网络的光固化聚氨酯丙烯酸酯胶粘剂(DSPUA)。这种动态网络之间的协同作用有效地解决了粘接强度和按需脱粘能力之间的权衡。双动态网络提供了强大而坚韧的粘接强度(5.88 MPa和8.99 kN/m),超过了现有的可控脱粘的光固化胶粘剂。二硫键可以在中等温度下快速脱键(在90℃下4分钟内完全脱离)。此外,DSPUA-2胶粘剂在紫外光照射或化学还原剂存在下,粘接强度也会显著降低。这项工作为高性能和可脱粘粘合剂的设计铺平了道路,对精密部件的临时固定和材料回收具有重要意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High-strength and debondable UV-curable adhesive based on dual-dynamic network
The temporary fixation of precision devices during manufacturing demands adhesives capable of high efficiency and controlled debonding, while existing thermosetting adhesives face challenges in on-demand debonding due to irreversible covalent crosslinking. To address this dilemma, UV-curable polyurethane acrylate adhesive (DSPUA) integrating dual-dynamic networks of hydrogen bonds and disulfide bonds was developed. This synergy between dynamic networks effectively resolved the trade-off between adhesive strength and on-demand debonding capability. The dual-dynamic network provided strong and tough adhesive strength (5.88 MPa and 8.99 kN/m), surpasing that of existing UV-curable adhesives featuring controlled debonding. The disulfide bonds enabled rapid debonding at medium temperatures (complete detachment within 4 min at 90 °C). In addition, the DSPUA-2 adhesive also experienced a significant reduction in adhesive strength when exposed to ultraviolet light or in the presence of chemical reducing agents. This work paves the way for the design of high-performance and debondable adhesives, with significant implications for temporary fixation of precision components and material recycling.
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来源期刊
Polymer Degradation and Stability
Polymer Degradation and Stability 化学-高分子科学
CiteScore
10.10
自引率
10.20%
发文量
325
审稿时长
23 days
期刊介绍: Polymer Degradation and Stability deals with the degradation reactions and their control which are a major preoccupation of practitioners of the many and diverse aspects of modern polymer technology. Deteriorative reactions occur during processing, when polymers are subjected to heat, oxygen and mechanical stress, and during the useful life of the materials when oxygen and sunlight are the most important degradative agencies. In more specialised applications, degradation may be induced by high energy radiation, ozone, atmospheric pollutants, mechanical stress, biological action, hydrolysis and many other influences. The mechanisms of these reactions and stabilisation processes must be understood if the technology and application of polymers are to continue to advance. The reporting of investigations of this kind is therefore a major function of this journal. However there are also new developments in polymer technology in which degradation processes find positive applications. For example, photodegradable plastics are now available, the recycling of polymeric products will become increasingly important, degradation and combustion studies are involved in the definition of the fire hazards which are associated with polymeric materials and the microelectronics industry is vitally dependent upon polymer degradation in the manufacture of its circuitry. Polymer properties may also be improved by processes like curing and grafting, the chemistry of which can be closely related to that which causes physical deterioration in other circumstances.
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