纳米氧化铜对生物医学和软包装用可生物降解聚合物基复合材料物理和功能性能的影响

IF 3.6 4区 工程技术 Q2 CHEMISTRY, APPLIED
H. M. Ragab, N. S. Diab, Rosilah Ab Aziz, Eshraga Abdallah Ali Elneim, Azzah M. Alghamdi, A. E. Tarabiah, M. O. Farea
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引用次数: 0

摘要

本研究将HPMC、PVA和CMC与氧化铜纳米粒子结合,探索可生物降解的纳米复合材料的发展,旨在创造具有改善抗菌性能的可持续包装材料。通过化学沉淀法合成CuO纳米颗粒,并通过铸造技术将其整合到聚合物共混物中。x射线衍射(XRD)分析证实了CuO的单斜晶结构和聚合物共混物的半晶性质。傅里叶变换红外光谱(FTIR)揭示了宿主聚合物与CuO纳米颗粒之间的相互作用。光学测试表明,CuO纳米颗粒的加入降低了直接能隙和间接能隙。电导率测量表明,随着CuO浓度的增加,电导率也随之增加,这是由于载流子迁移率的增强和结晶度的降低。接触角测量表明,随着CuO浓度的增加,疏水性降低,表明生物相容性改善。对HFB4成纤维细胞的细胞活力测试表明,细胞活力显著增加,在5.0 wt% CuO时观察到的最大值,表明具有良好的生物相容性,可用于生物医学应用。此外,抗菌试验显示对革兰氏阳性菌和革兰氏阴性菌均有显著的抑制作用,其中对革兰氏阳性菌的抑制作用更强。这些结果突出了CuO纳米颗粒在提高HPMC/PVA/CMC共混物性能方面的潜力,在生物降解包装材料、电子器件和生物医学领域提供了广阔的应用前景。可生物降解HPMC/PVA/CMC薄膜,采用CuO增强,环保使用。CuO纳米颗粒通过减小带隙改善了光学和电学性能。增强了对革兰氏阳性菌的抑菌活性。生物相容性证实,5.0 wt% CuO表现出最佳性能。发达的薄膜在生物医学用途和可持续包装方面很有前景。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Effects of CuO nanoparticles on the physical and functional properties of biodegradable polymer-based composites for biomedical and flexible packaging applications

Effects of CuO nanoparticles on the physical and functional properties of biodegradable polymer-based composites for biomedical and flexible packaging applications

Effects of CuO nanoparticles on the physical and functional properties of biodegradable polymer-based composites for biomedical and flexible packaging applications

Effects of CuO nanoparticles on the physical and functional properties of biodegradable polymer-based composites for biomedical and flexible packaging applications

This study explores the development of biodegradable nanocomposites using HPMC, PVA, and CMC, incorporated with copper oxide (CuO) nanoparticles, aiming to create sustainable packaging materials with improved antimicrobial properties. CuO nanoparticles were synthesized via a chemical precipitation method and integrated into the polymer blend through a casting technique. X-ray diffraction (XRD) analysis confirmed the monoclinic crystal structure of CuO and the semi-crystalline nature of the polymer blends. Fourier transform infrared (FTIR) spectroscopy revealed interactions between the host polymers and CuO nanoparticles. Optical tests showed that the addition of CuO nanoparticles reduced both the direct (Egd) and indirect (Egi) energy gaps. Electrical conductivity measurements indicated an increase in conductivity with higher CuO concentrations, attributed to enhanced charge carrier mobility and reduced crystallinity. Contact angle measurements indicated decreased hydrophobicity as CuO concentration increased, suggesting improved biocompatibility. Cell viability tests on HFB4 fibroblast cells demonstrated a significant increase in cell viability, with the highest value observed at 5.0 wt% CuO, indicating favorable biocompatibility for biomedical applications. Moreover, antimicrobial testing revealed significant inhibition against both Gram-positive and Gram-negative bacteria, with a stronger effect on Gram-positive strains. These results highlight the potential of CuO nanoparticles in enhancing the properties of HPMC/PVA/CMC blends, offering promising applications for biodegradable packaging materials, electronic devices, and biomedical fields.

Highlights

  • Biodegradable HPMC/PVA/CMC films enhanced using CuO for eco-friendly use.
  • CuO nanoparticles improved optical and electrical properties by reducing band gaps.
  • Enhanced antimicrobial activity observed against Gram-positive bacteria.
  • Biocompatibility confirmed, with 5.0 wt% CuO showing the best performance.
  • Developed films are promising for biomedical uses and sustainable packaging.
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来源期刊
Journal of Vinyl & Additive Technology
Journal of Vinyl & Additive Technology 工程技术-材料科学:纺织
CiteScore
5.40
自引率
14.80%
发文量
73
审稿时长
>12 weeks
期刊介绍: Journal of Vinyl and Additive Technology is a peer-reviewed technical publication for new work in the fields of polymer modifiers and additives, vinyl polymers and selected review papers. Over half of all papers in JVAT are based on technology of additives and modifiers for all classes of polymers: thermoset polymers and both condensation and addition thermoplastics. Papers on vinyl technology include PVC additives.
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