515nm波长GHz-Burst飞秒激光提高Cu烧蚀效率

IF 3.9 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Ashkan Momeni, Shota Kawabata, Kotaro Obata, Koji Sugioka
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引用次数: 0

摘要

近年来,千兆赫(GHz)突发模式飞秒激光器通过显著提高加工效率和质量,彻底改变了激光加工。然而,其潜在的机制尚不清楚,并且由于其数量众多,实验优化加工参数很困难。本研究采用基于仿真的理论方法研究了GHz-burst模式提高Cu烧蚀效率的潜在机制。采用双温度模型的仿真结果表明,由于在GHz突发中后续的内脉冲与前一个内脉冲熔化的Cu相互作用,提高了烧蚀效率。结果表明,在GHz-burst模式下,515 nm波长的Cu烧蚀性能优于红外模式,烧蚀效率是单脉冲模式的2.8倍。仿真结果与实验结果吻合较好。这里使用的方法不仅在理解潜在机制方面,而且在确定实际应用的最佳处理条件方面都取得了重大进展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

Improvement of Cu Ablation Efficiency Using GHz-Burst Femtosecond Laser at 515 nm Wavelength

Improvement of Cu Ablation Efficiency Using GHz-Burst Femtosecond Laser at 515 nm Wavelength

Improvement of Cu Ablation Efficiency Using GHz-Burst Femtosecond Laser at 515 nm Wavelength

Improvement of Cu Ablation Efficiency Using GHz-Burst Femtosecond Laser at 515 nm Wavelength

Improvement of Cu Ablation Efficiency Using GHz-Burst Femtosecond Laser at 515 nm Wavelength

In recent years, gigahertz (GHz)-burst-mode femtosecond lasers have revolutionized laser processing by significantly improving processing efficiency and quality. However, the underlying mechanisms are still unclear and experimentally optimizing the processing parameters is difficult due to their huge number. This study implements a theoretical approach based on simulations to investigate the underlying mechanisms of the Cu ablation efficiency enhancement by GHz-burst mode. The simulation results obtained using a two-temperature model suggest that the ablation efficiency is improved due to the interaction of subsequent intra-pulses in a GHz burst with Cu melted by the preceding intra-pulses. It is demonstrated that for GHz-burst mode, a 515 nm wavelength achieves higher Cu ablation performance than when using the infrared wavelength and demonstrates 2.8 times higher ablation efficiency than the single-pulse mode. The simulation results well agree with the experimental results. The approach used here represents a major advance not only in understanding the underlying mechanisms but also in determining the optimal processing conditions for practical applications.

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