了解机械热性能优越的纳米孪晶铜：制造过程、机制模型和技术应用

IF 19.3 1区化学 Q1 CHEMISTRY, PHYSICAL

Advances in Colloid and Interface Science Pub Date : 2025-08-25 DOI:10.1016/j.cis.2025.103630

Zhijie Zhang , Yulong Hu , Xiangyu Li , Fengjiang Wang , Yi Li , Anil Kunwar

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引用次数: 0

摘要

微电子技术的快速发展需要结合特殊强度、延展性和导电性的材料来连接应用和耐用的锂离子电池阳极。纳米孪晶铜（nt-Cu）通过使用纳米孪晶边界来增强机械和电学性能，超越了传统的强化方法，这些方法通常会损害延展性和导电性。本文综述了纳米铜的热力学特性、制造方法、多尺度力学见解和技术应用，将基础科学与工程实践联系起来。本研究采用信息学驱动的方法，结合先进的文本挖掘和可视化技术，阐明了nt-Cu结构和力学性能的关键趋势，推进了其在尖端连接技术中的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

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Understanding the mechanothermally superior nanotwinned copper: Fabrication procedure, mechanistic models and technological applications

The rapid evolution of microelectronics requires materials that combine exceptional strength, ductility, and electrical conductivity for joining applications and durable lithium-ion battery anodes. Nanotwinned Cu (nt-Cu) surpasses conventional strengthening approaches, which often compromise ductility and conductivity, by using nanoscale twin boundaries to enhance both mechanical and electrical properties. This review examines the thermomechanical characteristics, fabrication methods, multiscale mechanistic insights, and technological applications of nt-Cu, bridging fundamental science with engineering practice. Using an informatics-driven approach that incorporates advanced text mining and visualization techniques, this study elucidates key trends in the structural and mechanical properties of nt-Cu, advancing its application in cutting-edge joining technologies.

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来源期刊

Advances in Colloid and Interface Science 化学-物理化学

CiteScore

28.50

自引率

2.60%

发文量

175

审稿时长

31 days

期刊介绍： "Advances in Colloid and Interface Science" is an international journal that focuses on experimental and theoretical developments in interfacial and colloidal phenomena. The journal covers a wide range of disciplines including biology, chemistry, physics, and technology. The journal accepts review articles on any topic within the scope of colloid and interface science. These articles should provide an in-depth analysis of the subject matter, offering a critical review of the current state of the field. The author's informed opinion on the topic should also be included. The manuscript should compare and contrast ideas found in the reviewed literature and address the limitations of these ideas. Typically, the articles published in this journal are written by recognized experts in the field.