超高频频段稀疏线栅喇叭天线

IF 4.8 2区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Manh Tuan Nguyen;Adnan Faiezovich Alhaj Hasan;Talgat Rashitovich Gazizov
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引用次数: 0

摘要

本文将超高频喇叭天线的实体结构转化为稀疏的线网格结构。这项工作的新颖之处在于,首次通过应用最优电流网格近似(OCGA)及其对原始线网格结构的修正来生成实际的稀疏线网格结构。我们介绍了这些线网格结构的天线设计细节和天线特性的实验测量。仿真与实验得到的天线特性对比分析表明,原始线网格结构与稀疏线网格结构相互吻合良好,且与实体线网格结构吻合良好。生成的稀疏钢丝网结构比原钢丝网结构轻1.41倍,比实体结构轻9.23倍。本工作的结果证明了OCGA及其改进在保持天线性能的同时产生比原始线网格结构质量明显更小的稀疏线网格结构和实体结构的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sparse Wire-Grid Horn Antenna for the UHF Band
In this letter, the solid structure of a UHF-band horn antenna is transformed into a sparse wire-grid structure. The novelty of this work is that, for the first time, the actual sparse wire-grid structure was generated by applying optimal current grid approximation (OCGA) and its modifications to the original wire-grid structure. We present the antenna design details and experimental measurements of the antenna characteristics for these wire-grid structures. Comparative analysis of the antenna characteristics obtained by simulation and experiment shows that the original and sparse wire-grid structures are in good agreement with each other and with the solid structure. The generated sparse wire-grid structure is by 1.41 times less heavy than the original wire-grid structure and 9.23 times—than the solid structure. The results of this work demonstrate the effectiveness of OCGA and its modifications in generating sparse wire-grid structures with significantly less mass than the original wire-grid structures, as well as solid structures, while maintaining the antenna performance.
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来源期刊
CiteScore
8.00
自引率
9.50%
发文量
529
审稿时长
1.0 months
期刊介绍: IEEE Antennas and Wireless Propagation Letters (AWP Letters) is devoted to the rapid electronic publication of short manuscripts in the technical areas of Antennas and Wireless Propagation. These are areas of competence for the IEEE Antennas and Propagation Society (AP-S). AWPL aims to be one of the "fastest" journals among IEEE publications. This means that for papers that are eventually accepted, it is intended that an author may expect his or her paper to appear in IEEE Xplore, on average, around two months after submission.
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