Electroless copper-deposited basalt fibers with light-weight, high conductivity, and corrosion-resistance for next-generation communication networks

The increasing demand for high-performance materials in advanced technological applications, such as next-generation communication networks and efficient energy transmission, necessitates materials with enhanced mechanical, electrical, and corrosion properties. To address this, this study presents surface-modified basalt fibers (BFs) achieved through a novel, precisely controlled electroless copper (Cu) deposition, resulting in enhanced properties. The electroless Cu deposition onto BFs was optimized by varying the deposition temperature (20–60 °C) to maximize electrical conductivity and tensile strength. An optimal deposition temperature of 50 °C yielded desirable properties, with microstructural analysis confirming a dense, highly crystalline Cu deposition that exhibited a high tensile strength of 1561 ± 320 MPa and a direct current (DC) electrical conductivity of 9.63 × 10⁷ S/m, surpassing that of commercial Cu (5.96 × 10⁷ S/m) and Ag (6.30 × 10⁷ S/m). The corrosion behavior, evaluated by immersion testing in 5 v/v% sulfuric acid (H₂SO₄), indicated minimal corrosion. This surface modification also resulted in a significantly lower density of 3.34 g/cm³ (post-corrosion at 50 °C) compared to bulk Cu (8.96 g/cm³) and alternating current (AC) conductivities of 3.88 × 10⁷ and 1.86 × 10⁷ S/m (at 0.2 and 0.5 MHz, respectively). Consequently, these light-weight, sustainable materials demonstrate significant potential as alternatives to conventional Cu in applications demanding high conductivity, mechanical strength, and corrosion resistance, such as fifth-generation (5G) and future sixth-generation (6G) telecommunications, aerospace, and light-weight wires for power transmission.