S. D. Latushkina, O. I. Posylkina, I. N. Zhoglik, I. A. Sechko
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引用次数: 0
摘要
采用真空电弧沉积技术，在分离等离子体流中制备了基于Ti-Cu-N体系的涂层。研究了反应气体压力对涂层电化学性能的影响。通过对Ti-Cu-N镀层元素、相组成与电化学特性关系的研究表明，当镀层中铜的浓度为4-7 at %时，镀层的阳极溶解电流密度较低，这是由于铜沿氮化钛晶界的耐蚀性所致。当铜含量增加到12at %时，会形成以Ti2N和СuN3为基体的两相涂层，从而降低其耐腐蚀性。对多层TiN/TiCu(7 at %)N/TiN/TiCu(7 at %)N涂层的耐蚀性研究表明，与单层TiCu(7 at %)N相比，逐层沉积使多层涂层的阳极溶解电流密度降低了4倍，这是由于相界面长度增加、孔隙率降低和结构非均质性降低所致。
Study of the Process of Formation of Corrosion-Resistant Coatings of the Ti–Cu–N System Obtained by the Vacuum Arc Deposition Method for Medical Products
Coatings based on the Ti–Cu–N system were obtained from separated plasma flows by vacuum-arc deposition. The effect of reaction gas pressure on the electrochemical behavior of coatings has been studied. The study of the relationship between the elemental, phase composition of Ti–Cu–N coatings and their electrochemical characteristics showed that coatings with a copper concentration of 4–7 at % in their composition are characterized by low values of the anodic dissolution current density, which is due to the corrosion resistance of copper located along the grain boundaries of titanium nitride. Increasing the copper content to 12 at % leads to the formation of a two-phase coating based on Ti2N and СuN3, which, as a result, reduces its corrosion resistance. The study of the corrosion resistance of the multilayer TiN/TiCu (7 at %)N/TiN/TiCu(7 at %)N coatings showed that layer-by-layer deposition makes it possible to reduce the current density of the anodic dissolution of the multilayer coating by a factor of four compared to the single-layer TiCu(7 at %)N, which is due to the increased length of interphase boundaries, a decrease in porosity, and structural heterogeneity.
期刊介绍：
Surface Engineering and Applied Electrochemistry is a journal that publishes original and review articles on theory and applications of electroerosion and electrochemical methods for the treatment of materials; physical and chemical methods for the preparation of macro-, micro-, and nanomaterials and their properties; electrical processes in engineering, chemistry, and methods for the processing of biological products and food; and application electromagnetic fields in biological systems.
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