大功率微电子冷却用后嵌式微针翅片阵列散热性能研究

IF 5 2区工程技术 Q1 ENGINEERING, MECHANICAL

International Journal of Thermal Sciences Pub Date : 2025-09-04 DOI:10.1016/j.ijthermalsci.2025.110273

Huicheng Feng, Gongyue Tang, Xiaowu Zhang

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引用次数: 0

摘要

嵌入式微针翅的液体冷却由于其以最小的流动阻力增强传热的能力而越来越受到微电子领域的关注。各种冷却剂已被用于微针鳍冷却系统。本研究研究了三种典型的冷却剂，即去离子水、Novec 7500（介电液体）和GaInSn（液态金属），在一系列工作条件下应用于背面嵌入微针鳍芯片的冷却性能。用去离子水对数值模拟模型进行了验证。模拟结果表明，在0-50μm范围内，冷却性能对尖端间隙基本不敏感，通过适应键合层厚度的变化，有利于集成。当使用去离子水和Novec 7500时，微针翅间距对换热效率有显著影响，但由于GaInSn具有优异的导热性，对其影响很小。这表明，与传统冷却剂相比，基于液态金属的微冷却器，如使用GaInSn的微冷却器，设计更简单，流动阻力显著降低。此外，GaInSn在相同的操作条件下表现出更高的性能系数。这些发现为优化微冷却器设计和冷却剂选择以改善高性能微电子的热管理提供了有价值的见解。

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Investigation of coolant-dependent thermal performance in backside-embedded micro-pin fin arrays for high-power microelectronics cooling

Liquid cooling with embedded micro-pin fins is gaining increasing attention for microelectronics due to its ability to enhance heat transfer with minimal flow resistance. Various coolants have been employed in micro-pin fin cooling systems. This study investigates the cooling performance of three typical coolants, namely, deionized water, Novec 7500 (a dielectric liquid), and GaInSn (a liquid metal), applied to a chip with backside-embedded micro-pin fins under a range of operating conditions. The numerical simulation models are validated against experimental data using deionized water. The simulation results show that the cooling performance remains largely insensitive to tip clearance in the range of 0–

50 μ m

, offering an advantage for integration by accommodating variations in bonding layer thickness. The pitch of micro-pin fins significantly affects the heat transfer efficiency when using deionized water and Novec 7500, but has minimal influence on GaInSn due to its superior thermal conductivity. This suggests that liquid metal-based microcoolers, such as those using GaInSn, enable simpler designs with markedly reduced flow resistance compared to conventional coolants. Additionally, GaInSn exhibits a substantially higher coefficient of performance under identical operating conditions. These findings provide valuable insights for optimizing microcooler design and coolant selection to improve thermal management in high-performance microelectronics.

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来源期刊

International Journal of Thermal Sciences 工程技术-工程：机械

CiteScore

8.10

自引率

11.10%

发文量

531

审稿时长

55 days

期刊介绍： The International Journal of Thermal Sciences is a journal devoted to the publication of fundamental studies on the physics of transfer processes in general, with an emphasis on thermal aspects and also applied research on various processes, energy systems and the environment. Articles are published in English and French, and are subject to peer review. The fundamental subjects considered within the scope of the journal are: * Heat and relevant mass transfer at all scales (nano, micro and macro) and in all types of material (heterogeneous, composites, biological,...) and fluid flow * Forced, natural or mixed convection in reactive or non-reactive media * Single or multi–phase fluid flow with or without phase change * Near–and far–field radiative heat transfer * Combined modes of heat transfer in complex systems (for example, plasmas, biological, geological,...) * Multiscale modelling The applied research topics include: * Heat exchangers, heat pipes, cooling processes * Transport phenomena taking place in industrial processes (chemical, food and agricultural, metallurgical, space and aeronautical, automobile industries) * Nano–and micro–technology for energy, space, biosystems and devices * Heat transport analysis in advanced systems * Impact of energy–related processes on environment, and emerging energy systems The study of thermophysical properties of materials and fluids, thermal measurement techniques, inverse methods, and the developments of experimental methods are within the scope of the International Journal of Thermal Sciences which also covers the modelling, and numerical methods applied to thermal transfer.