Qifei Mao
(, ), Min Hu
(, ), Jiahao Wang
(, ), Chong Li
(, ), Jinfeng Nie
(, ), Zongning Chen
(, ), Yongchang Liu
(, )
{"title":"TiB2颗粒对Al-Cu-Mg合金热变形和再结晶行为的影响","authors":"Qifei Mao \n (, ), Min Hu \n (, ), Jiahao Wang \n (, ), Chong Li \n (, ), Jinfeng Nie \n (, ), Zongning Chen \n (, ), Yongchang Liu \n (, )","doi":"10.1007/s40843-025-3461-5","DOIUrl":null,"url":null,"abstract":"<div><p>To reveal the influence of TiB<sub>2</sub> particles on the thermal deformation behavior of Al-Cu-Mg alloys, thermal compression experiments were conducted in the temperature range of 340 to 500 °C, the strain rate range of 0.01 to 10 s<sup>−1</sup>. Arrhenius-type constitutive equations were formulated to characterize the flow behavior of the alloys, and the microstructures of the deformed alloys were analyzed. The results indicate that TiB<sub>2</sub> particles markedly refine the grains of Al-Cu-Mg alloys from 117 to 35 µm (0.1 wt% TiB<sub>2</sub>) and 29 µm (1 wt% TiB<sub>2</sub>). Both the reduction of grain size and the presence of TiB<sub>2</sub> particles contribute to an increased flow stress during thermal deformation. And the grain refinement induced by the addition of TiB<sub>2</sub> particles enhances dynamic recrystallization processes. The excess TiB<sub>2</sub> particles (1 wt% TiB<sub>2</sub>) further stimulate dynamic recrystallization via the particle-stimulated nucleation mechanism. Moreover, the addition of TiB<sub>2</sub> particles effectively suppresses the coarsening of recrystallized grains in Al-Cu-Mg alloys following thermal deformation.\n</p><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":773,"journal":{"name":"Science China Materials","volume":"68 9","pages":"3332 - 3343"},"PeriodicalIF":7.4000,"publicationDate":"2025-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effect of TiB2 particles on the thermal deformation and recrystallization behaviour of Al-Cu-Mg alloys\",\"authors\":\"Qifei Mao \\n (, ), Min Hu \\n (, ), Jiahao Wang \\n (, ), Chong Li \\n (, ), Jinfeng Nie \\n (, ), Zongning Chen \\n (, ), Yongchang Liu \\n (, )\",\"doi\":\"10.1007/s40843-025-3461-5\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>To reveal the influence of TiB<sub>2</sub> particles on the thermal deformation behavior of Al-Cu-Mg alloys, thermal compression experiments were conducted in the temperature range of 340 to 500 °C, the strain rate range of 0.01 to 10 s<sup>−1</sup>. Arrhenius-type constitutive equations were formulated to characterize the flow behavior of the alloys, and the microstructures of the deformed alloys were analyzed. The results indicate that TiB<sub>2</sub> particles markedly refine the grains of Al-Cu-Mg alloys from 117 to 35 µm (0.1 wt% TiB<sub>2</sub>) and 29 µm (1 wt% TiB<sub>2</sub>). Both the reduction of grain size and the presence of TiB<sub>2</sub> particles contribute to an increased flow stress during thermal deformation. And the grain refinement induced by the addition of TiB<sub>2</sub> particles enhances dynamic recrystallization processes. The excess TiB<sub>2</sub> particles (1 wt% TiB<sub>2</sub>) further stimulate dynamic recrystallization via the particle-stimulated nucleation mechanism. Moreover, the addition of TiB<sub>2</sub> particles effectively suppresses the coarsening of recrystallized grains in Al-Cu-Mg alloys following thermal deformation.\\n</p><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>\",\"PeriodicalId\":773,\"journal\":{\"name\":\"Science China Materials\",\"volume\":\"68 9\",\"pages\":\"3332 - 3343\"},\"PeriodicalIF\":7.4000,\"publicationDate\":\"2025-07-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Science China Materials\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s40843-025-3461-5\",\"RegionNum\":2,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q1\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Science China Materials","FirstCategoryId":"88","ListUrlMain":"https://link.springer.com/article/10.1007/s40843-025-3461-5","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
Effect of TiB2 particles on the thermal deformation and recrystallization behaviour of Al-Cu-Mg alloys
To reveal the influence of TiB2 particles on the thermal deformation behavior of Al-Cu-Mg alloys, thermal compression experiments were conducted in the temperature range of 340 to 500 °C, the strain rate range of 0.01 to 10 s−1. Arrhenius-type constitutive equations were formulated to characterize the flow behavior of the alloys, and the microstructures of the deformed alloys were analyzed. The results indicate that TiB2 particles markedly refine the grains of Al-Cu-Mg alloys from 117 to 35 µm (0.1 wt% TiB2) and 29 µm (1 wt% TiB2). Both the reduction of grain size and the presence of TiB2 particles contribute to an increased flow stress during thermal deformation. And the grain refinement induced by the addition of TiB2 particles enhances dynamic recrystallization processes. The excess TiB2 particles (1 wt% TiB2) further stimulate dynamic recrystallization via the particle-stimulated nucleation mechanism. Moreover, the addition of TiB2 particles effectively suppresses the coarsening of recrystallized grains in Al-Cu-Mg alloys following thermal deformation.
期刊介绍:
Science China Materials (SCM) is a globally peer-reviewed journal that covers all facets of materials science. It is supervised by the Chinese Academy of Sciences and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China. The journal is jointly published monthly in both printed and electronic forms by Science China Press and Springer. The aim of SCM is to encourage communication of high-quality, innovative research results at the cutting-edge interface of materials science with chemistry, physics, biology, and engineering. It focuses on breakthroughs from around the world and aims to become a world-leading academic journal for materials science.