TiB2颗粒对Al-Cu-Mg合金热变形和再结晶行为的影响

IF 7.4 2区 材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY
Qifei Mao  (, ), Min Hu  (, ), Jiahao Wang  (, ), Chong Li  (, ), Jinfeng Nie  (, ), Zongning Chen  (, ), Yongchang Liu  (, )
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引用次数: 0

摘要

为了揭示TiB2颗粒对Al-Cu-Mg合金热变形行为的影响,在温度340 ~ 500℃,应变速率0.01 ~ 10 s−1范围内进行了热压缩实验。建立了表征合金流动行为的arrhenius型本构方程,并对变形合金的组织进行了分析。结果表明,TiB2颗粒使Al-Cu-Mg合金的晶粒细化到117 ~ 35µm (0.1 wt% TiB2)和29µm (1 wt% TiB2);晶粒尺寸的减小和TiB2颗粒的存在都导致了热变形过程中流动应力的增加。TiB2颗粒的加入促进了动态再结晶过程。过量的TiB2粒子(1wt % TiB2)通过粒子激发成核机制进一步刺激动态再结晶。此外,TiB2颗粒的加入有效地抑制了Al-Cu-Mg合金热变形后再结晶晶粒的粗化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of TiB2 particles on the thermal deformation and recrystallization behaviour of Al-Cu-Mg alloys

To reveal the influence of TiB2 particles on the thermal deformation behavior of Al-Cu-Mg alloys, thermal compression experiments were conducted in the temperature range of 340 to 500 °C, the strain rate range of 0.01 to 10 s−1. Arrhenius-type constitutive equations were formulated to characterize the flow behavior of the alloys, and the microstructures of the deformed alloys were analyzed. The results indicate that TiB2 particles markedly refine the grains of Al-Cu-Mg alloys from 117 to 35 µm (0.1 wt% TiB2) and 29 µm (1 wt% TiB2). Both the reduction of grain size and the presence of TiB2 particles contribute to an increased flow stress during thermal deformation. And the grain refinement induced by the addition of TiB2 particles enhances dynamic recrystallization processes. The excess TiB2 particles (1 wt% TiB2) further stimulate dynamic recrystallization via the particle-stimulated nucleation mechanism. Moreover, the addition of TiB2 particles effectively suppresses the coarsening of recrystallized grains in Al-Cu-Mg alloys following thermal deformation.

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来源期刊
Science China Materials
Science China Materials Materials Science-General Materials Science
CiteScore
11.40
自引率
7.40%
发文量
949
期刊介绍: Science China Materials (SCM) is a globally peer-reviewed journal that covers all facets of materials science. It is supervised by the Chinese Academy of Sciences and co-sponsored by the Chinese Academy of Sciences and the National Natural Science Foundation of China. The journal is jointly published monthly in both printed and electronic forms by Science China Press and Springer. The aim of SCM is to encourage communication of high-quality, innovative research results at the cutting-edge interface of materials science with chemistry, physics, biology, and engineering. It focuses on breakthroughs from around the world and aims to become a world-leading academic journal for materials science.
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