ZrO2/Ti6Al4V玻璃连接件钎焊密封工艺优化:界面影响研究

IF 5.6 2区 材料科学 Q1 MATERIALS SCIENCE, CERAMICS
Fei Ji, Yuanxing Li, Wenxin Dong, Yuanjie Chi, Menglin Li, Lukai Luo, Tao Zou, Hui Chen
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引用次数: 0

摘要

本研究系统地研究了空气环境中钎焊Ti6Al4V钛合金与ZrO2陶瓷用铋基密封玻璃的界面强化机理。作为航空航天、生物医学和电子封装应用的关键材料,钛合金和陶瓷的可靠连接对于扩大其复合应用具有重要意义。考虑到密封玻璃的热敏性,需要精确控制焊接温度以实现可靠的连接,本研究探讨了钎焊温度和保温时间对界面结构和力学性能的影响。当钎焊工艺参数优化至650℃/30 min时,接头抗剪强度最高,平均为35 MPa。在此优化条件下,界面处形成了由纳米级Bi4Ti3O12析出相和Bi单相组成的复合结构,通过化学键合有效提高了非均质材料的结合强度。当温度超过临界值或保温时间延长时,析出相发生异常粗化,导致应力集中效应加剧,界面结合强度显著下降。通过建立工艺参数、界面结构和力学性能之间的关联机制,证实了控制界面析出物的大小是提高金属/陶瓷接头结合强度的关键因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimization of braze sealing process for ZrO2/Ti6Al4V glass connections: Interface impact studies
This study systematically investigates the interface-strengthening mechanisms of bismuth-based sealing glass for brazing Ti6Al4V titanium alloy and ZrO2 ceramic in an air environment. As key materials in aerospace, biomedical, and electronic packaging applications, the reliable joining of titanium alloys and ceramics is significant for expanding their composite applications. Given the thermal sensitivity of sealing glass, which requires precise control of the bonding temperature to achieve reliable connections, this study explores the influence of brazing temperature and holding time on the interface structure and mechanical properties. When the brazing process parameters were optimized to 650 °C/30 min, the joint achieved the highest shear strength, with an average value of 35 MPa. Under these optimized conditions, a composite structure consisting of nanoscale Bi4Ti3O12 precipitates and Bi single-phase formed at the interface, effectively enhancing the bonding strength of the heterogeneous materials through chemical bonding. When the temperature exceeded the critical value or the holding time was extended, abnormal coarsening of the precipitates occurred, leading to intensified stress concentration effects and a significant decline in interfacial bonding strength. By establishing the correlation mechanism among process parameters, interface structure, and mechanical properties, this study confirms that controlling the size of interfacial precipitates is a key factor in improving the bonding strength of metal/ceramic joints.
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来源期刊
Ceramics International
Ceramics International 工程技术-材料科学:硅酸盐
CiteScore
9.40
自引率
15.40%
发文量
4558
审稿时长
25 days
期刊介绍: Ceramics International covers the science of advanced ceramic materials. The journal encourages contributions that demonstrate how an understanding of the basic chemical and physical phenomena may direct materials design and stimulate ideas for new or improved processing techniques, in order to obtain materials with desired structural features and properties. Ceramics International covers oxide and non-oxide ceramics, functional glasses, glass ceramics, amorphous inorganic non-metallic materials (and their combinations with metal and organic materials), in the form of particulates, dense or porous bodies, thin/thick films and laminated, graded and composite structures. Process related topics such as ceramic-ceramic joints or joining ceramics with dissimilar materials, as well as surface finishing and conditioning are also covered. Besides traditional processing techniques, manufacturing routes of interest include innovative procedures benefiting from externally applied stresses, electromagnetic fields and energetic beams, as well as top-down and self-assembly nanotechnology approaches. In addition, the journal welcomes submissions on bio-inspired and bio-enabled materials designs, experimentally validated multi scale modelling and simulation for materials design, and the use of the most advanced chemical and physical characterization techniques of structure, properties and behaviour. Technologically relevant low-dimensional systems are a particular focus of Ceramics International. These include 0, 1 and 2-D nanomaterials (also covering CNTs, graphene and related materials, and diamond-like carbons), their nanocomposites, as well as nano-hybrids and hierarchical multifunctional nanostructures that might integrate molecular, biological and electronic components.
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