Jeongmin Kim;Jaehoon Kwon;Hansol Jeong;In-Cheol Park
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Energy-Efficient Syndrome Calculation Architecture for BCH Decoders
Syndrome calculation (SC) is a critical step in Bose-Chaudhuri-Hocquenghem (BCH) decoding, and its computational efficiency significantly impacts the energy consumption of the entire decoder. This article proposes an energy-efficient SC architecture designed for BCH decoders. The proposed architecture fundamentally adopts a remainder-based SC, which consumes less energy than the conventional Horner’s method-based SC unit. Furthermore, unlike previous remainder-based approaches, it uses a minimal polynomial to produce a shorter remainder, leading to reduced computation and improved energy efficiency. Implementation results demonstrate an 80% improvement in energy efficiency compared to the latest Horner’s method-based SC unit and a 35% improvement compared to the previous remainder-based SC unit.
期刊介绍:
The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society.
Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels.
To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.