多层衬底的非接触介电光谱:迈向芯片上器官的应用

IF 3.2 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Tim Hosman;Massimo Mastrangeli;Marco Spirito
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引用次数: 0

摘要

介电光谱是一种无标签、非接触、实时、多层传感技术,已被用于许多生物材料的鉴定和定量。对器官芯片系统的监测需要这些传感功能的组合;然而,现有的传感技术尚未满足这一需求。在这项工作中,我们通过研究使用开放式同轴探头的三个关键技术发展,探索利用介电光谱的固有特征在器官芯片系统中应用的可能性。首先,通过显示聚对二甲苯c涂层探针与非涂层探针的相似传感性能,证明了其生物相容性非接触传感能力。其次,开发了一种用于高精度和非破坏性探针高度定位的装置和方法,以允许精确提取中间样品层。最后,通过三层系统中的生物幻影,成功地验证了该技术的非接触式多层传感性能。通过进一步集成,电介质光谱可以成为芯片上器官的基础传感技术,实现对各种组织内容和特性的实时非接触式跟踪。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Non-Contact Dielectric Spectroscopy of Multi-Layered Substrates: Towards Organ-on-Chip Applications
Dielectric spectroscopy is a label-free, non-contact, real-time, multi-layer sensing technology, and has been used for identification and quantification of many biological materials. A combination of such sensing features is in demand for monitoring of organ-on-chip systems; however available sensing technologies have yet to address this need. In this work, we explore the possibility of leveraging the inherent features of dielectric spectroscopy for the application in organ-on-chip systems, by investigating three key technological developments using open-ended coaxial probes. Firstly, biocompatible non-contact sensing capabilities are proved by showing similar sensing performance of Parylene C-coated probes and uncoated probes. Secondly, a setup and methodology are developed for highly accurate and non-destructive height positioning of the probe to allow for precise extraction of intermediate sample layers. Finally, non-contact multi-layer sensing performance of the presented technology is successfully demonstrated by means of a biological phantom in a three-layered system. With further integration, dielectric spectroscopy can potentially become a cornerstone sensing technique for organ-on-chip by enabling real-time non-contact tracking of various tissue contents and properties.
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来源期刊
CiteScore
5.80
自引率
9.40%
发文量
58
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