对“用于加速变压器前馈网络的高效两阶段流水线内存计算宏”的修正

IF 3.1 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Heng Zhang;Wenhe Yin;Sunan He;Yuan Du;Li Du
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引用次数: 0

摘要

在上述文章[1]中,原图9右侧的模具照片无意中被水平镜像,如图1所示。这发生在注释过程中,使用的图像在我们没有意识到的情况下已经被翻转了。因此,内部布局标签(例如,CIMA1, CIMA2和ADC)相对于实际模具出现相反的方向。1.我们发表文章的原始图9与修改后的图9的差异澄清。图9所示。所提出的芯片的模具照片和测量设置。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Corrections to “An Efficient Two-Stage Pipelined Compute-in-Memory Macro for Accelerating Transformer Feed-Forward Networks”
In the above article [1], the die photograph on the right side of original Fig. 9 was inadvertently mirrored horizontally, as shown in Fig. 1. This occurred during the annotation process, where the image used had already been flipped without our awareness. As a result, the internal layout labeling (e.g., CIMA1, CIMA2, and ADC) appeared in reverse orientation relative to the actual die.Fig. 1.Difference clarification between the original Fig. 9 of our published article and the revised Fig. 9. Fig. 9.Die photograph and measure setup for the proposed chip.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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