基于RRAM-CMOS标准单元的RISC-V CPU设计

IF 3.1 2区 工程技术 Q2 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE
Markus Fritscher;Max Uhlmann;Philip Ostrovskyy;Daniel Reiser;Junchao Chen;Jianan Wen;Carsten Schulze;Gerhard Kahmen;Dietmar Fey;Marc Reichenbach;Milos Krstic;Christian Wenger
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引用次数: 0

摘要

Dennard缩放的崩溃已经成为许多创新的驱动力,如多核cpu,并推动了对新器件的研究,如电阻随机存取存储器(RRAM)。这些器件可能是扩展集成电路可扩展性的一种手段,因为它们允许快速和非易失性操作。不幸的是,为了从这些单元中获益,需要设计和集成大型模拟电路,这阻碍了大型系统的实现。这项工作阐述了一种新的解决方案,即利用RRAM设备创建数字标准单元。尽管这种方法既可以用于小栅极,也可以用于大宏块,但我们将以22t2r单元为例进行说明。由于RRAM器件可以与晶体管垂直堆叠,这使我们能够构建一个nand标准单元,它仅消耗两个晶体管的面积。这导致与等效CMOS nand栅极相比,面积减少25%。我们用半加法器电路说明了可实现的面积节省,并将这种新颖的单元集成到数字标准单元库中。使用基于rram的单元的合成RISC-V内核的面积比使用标准CMOS栅极的等效设计小10.7%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
RISC-V CPU Design Using RRAM-CMOS Standard Cells
The breakdown of Dennard scaling has been the driver for many innovations such as multicore CPUs and has fueled the research into novel devices such as resistive random access memory (RRAM). These devices might be a means to extend the scalability of integrated circuits since they allow for fast and nonvolatile operation. Unfortunately, large analog circuits need to be designed and integrated in order to benefit from these cells, hindering the implementation of large systems. This work elaborates on a novel solution, namely, creating digital standard cells utilizing RRAM devices. Albeit this approach can be used both for small gates and large macroblocks, we illustrate it for a 2T2R-cell. Since RRAM devices can be vertically stacked with transistors, this enables us to construct a nand standard cell, which merely consumes the area of two transistors. This leads to a 25% area reduction compared to an equivalent CMOS nand gate. We illustrate achievable area savings with a half-adder circuit and integrate this novel cell into a digital standard cell library. A synthesized RISC-V core using RRAM-based cells results in a 10.7% smaller area than the equivalent design using standard CMOS gates.
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来源期刊
CiteScore
6.40
自引率
7.10%
发文量
187
审稿时长
3.6 months
期刊介绍: The IEEE Transactions on VLSI Systems is published as a monthly journal under the co-sponsorship of the IEEE Circuits and Systems Society, the IEEE Computer Society, and the IEEE Solid-State Circuits Society. Design and realization of microelectronic systems using VLSI/ULSI technologies require close collaboration among scientists and engineers in the fields of systems architecture, logic and circuit design, chips and wafer fabrication, packaging, testing and systems applications. Generation of specifications, design and verification must be performed at all abstraction levels, including the system, register-transfer, logic, circuit, transistor and process levels. To address this critical area through a common forum, the IEEE Transactions on VLSI Systems have been founded. The editorial board, consisting of international experts, invites original papers which emphasize and merit the novel systems integration aspects of microelectronic systems including interactions among systems design and partitioning, logic and memory design, digital and analog circuit design, layout synthesis, CAD tools, chips and wafer fabrication, testing and packaging, and systems level qualification. Thus, the coverage of these Transactions will focus on VLSI/ULSI microelectronic systems integration.
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